Multi-Module Laser Heating for Wide Substrate Regions
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Solution Overview
Problem
Existing substrate processing methods face limitations in heating wide regions efficiently due to the output constraints of Digital Micro-mirror Devices (DMDs), leading to increased process time and decreased throughput.
Innovation Solution
A substrate processing apparatus with a laser emission assembly comprising multiple laser emission modules and a control unit that adjusts and emits lasers to various unit emission regions, allowing simultaneous heating of large areas by arranging modules in lines or rotating the substrate, thereby overcoming DMD limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single DMD is used to heat a wide region of a substrate, then the apparatus structure remains simple, but the process time increases and throughput decreases
Solution Approach 1:
The patent divides the single DMD into multiple independent DMDs (first DMD and second DMD), each responsible for heating specific regions of the substrate. This segmentation allows parallel heating operations, reducing total process time and improving throughput while maintaining manageable system complexity through modular architecture.
Solution Approach 2:
The patent combines multiple DMDs and their corresponding laser sources into a unified heating system that operates simultaneously on different substrate regions. By merging these components into a coordinated system controlled by a single controller, the patent achieves parallel processing that improves throughput without proportionally increasing control complexity.
2Productivity
If multiple DMDs are used to heat wide regions simultaneously, then the throughput increases, but the device complexity increases
Solution Approach 1:
Each DMD module is designed as a universal heating unit capable of independently heating any assigned region of the substrate. The first DMD and second DMD share the same functional capabilities and structural design, allowing the system to handle different substrate sizes and heating patterns using the same modular components, thereby managing complexity through standardization.
Solution Approach 2:
The patent transitions from a single-point or single-region heating approach to a multi-dimensional parallel heating system. By arranging multiple DMDs to target different spatial regions simultaneously (first region and second region), the system adds a spatial dimension to the heating process, improving throughput without linearly increasing control complexity through distributed modular architecture.
3Productivity
If the laser emission area is increased to heat wide regions, then the heating efficiency improves, but the DMD output limitations are exceeded
Solution Approach 1:
The patent segments the total heating requirement into multiple smaller heating zones, each handled by a separate DMD. The first DMD heats the first region while the second DMD heats the second region, allowing each DMD to operate within its power output limitations while collectively achieving wide-region heating with high overall efficiency.
Solution Approach 2:
The patent creates multiple copies of the DMD-laser source system (first DMD with first laser source, second DMD with second laser source), where each copy operates independently within its own power limits. This replication allows the system to achieve total heating power and efficiency that exceeds what a single DMD could provide, while each individual component remains within its operational constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables efficient and simultaneous heating of wide substrate regions, effectively adjusting critical dimensions and processing substrates with reduced time requirements.
Implementation Method 1
a laser emission assembly emitting a laser to the substrate
Implementation Method 2
The degree of etching depends on the amount of heat transmitted by light per unit time
Data Source
AI summary
The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a supporting unit supporting a substrate; a laser emission assembly emitting a laser to the substrate, wherein the laser emission assembly includes: a laser source generating a laser; and a plurality of laser emission modules, the laser emission modules each include: a light modulation unit modulating distribution of a laser generated by the laser source; and an imaging unit adjusting and emitting the laser modulated by the light modulation unit to the substrate to correspond to an area to which the laser is emitted, an entire region that needs to be heated on the substrate is composed of a plurality of unit emission regions, and the plurality of laser emission modules are arranged to be able to emit the laser respectively to the different unit emission regions of the substrate supported on the supporting unit.