Laser Hole Ablation Patterns for Faster Turbine Part Clearing
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Solution Overview
Problem
The existing methods for clearing debris and obstructions from numerous holes in gas turbine parts after coating operations are inefficient, requiring substantial time and effort, and often result in damage to the parts due to the physical movement of cutting devices or the parts themselves.
Innovation Solution
A laser ablation system that uses a control system to establish and switch between different laser operating parameters and ablation patterns to clear holes without physical translation of the laser or the part, minimizing damage by optimizing laser power, pulse width, and ablation patterns based on the material properties and thermal characteristics of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If computer-controlled cutting devices are used to clear debris from numerous holes on complex contoured surfaces, then the holes can be cleared, but the process becomes difficult and time consuming requiring movement and reorientation of the laser for each hole
Solution Approach 1:
The patent segments the holes into multiple groups based on their spatial distribution and characteristics on the complex contoured surface. Each group is processed with optimized laser parameters specific to its location and geometry, allowing parallel processing strategies and reducing the need for repeated laser reorientation while maintaining clearing quality
Solution Approach 2:
The patent performs preliminary characterization of the holes and their groups before the actual clearing process. This includes pre-determining optimal laser parameters, pulse sequences, and processing sequences for each hole group, which enables the laser to clear holes efficiently without time-consuming adjustments during the actual processing phase
2Ease of operation
If the cutting device or part is physically moved for each hole clearing operation, then access to different holes is achieved, but the overall process efficiency decreases as the cutting device does not operate during movement
Solution Approach 1:
The patent employs dynamic control of the laser beam delivery system that can rapidly reposition and reorient the laser beam to different hole groups without physical movement of the cutting device or part. The system dynamically adjusts laser parameters and beam direction in real-time, maintaining continuous operation and eliminating idle movement time to maximize productivity
Solution Approach 2:
The patent replaces the mechanical movement system (physical translation of laser or part) with an optical/electromagnetic field-based solution. The laser beam is steered and focused to different locations using optical elements and control systems, eliminating the need for mechanical repositioning and enabling continuous operation without interruption for movement
3Loss of substance
If laser ablation is used to clear holes, then debris removal is achieved, but thermal damage may occur to the substrate if laser parameters are not optimized
Solution Approach 1:
The patent systematically varies and optimizes multiple laser parameters including pulse width, repetition rate, average power, and pulse energy to achieve effective debris removal while minimizing thermal damage. Different parameter sets are assigned to different hole groups based on their characteristics, allowing precise control of the ablation process to remove debris without overheating the substrate
Solution Approach 2:
The patent uses pulsed laser operation with specific repetition rates and pulse sequences that allow thermal diffusion time between pulses. This periodic action enables the substrate to cool between laser pulses, preventing cumulative thermal damage while still achieving effective debris removal through repeated controlled ablation cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and effort required to clear holes, enhances part throughput, and minimizes thermal damage to the substrate by using optimized laser characteristics and patterns that allow for efficient debris removal without negatively impacting the coated surfaces.
Implementation Method 1
a laser configured to deliver laser beam pulses to at least one hole in a group of holes of an article
Implementation Method 2
The control system controls the laser to ablate the at least one hole
Data Source
AI summary
A method of processing a group of holes in an article is provided. The method includes an establishing step that establishes an ablation characteristic including at least one of, a laser operating parameter and an ablation pattern for the group of holes. An ablating step ablates a first group of holes with a laser based on a first established ablation characteristic. A second ablating step ablates a second group of holes with the laser based on a second established ablation characteristic. The first established ablation characteristic is different from the second established ablation characteristic.