Laser Hole Ablation Parameter Switching for Coated Turbine Parts
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Solution Overview
Problem
The existing methods for clearing debris and obstructions from numerous holes in gas turbine parts after coating operations are inefficient, requiring substantial time and effort, and often result in damage to the parts due to the need for physical movement of cutting devices or parts, which disrupts the process and increases inefficiency.
Innovation Solution
A laser ablation system that uses a control system to establish and switch between different laser operating parameters and ablation patterns to efficiently clear holes without physical translation of the laser or part, minimizing damage by varying power, pulse width, and ablation patterns based on material properties and thermal capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If computer-controlled cutting devices are used to clear debris from numerous holes on complex contoured surfaces, then the holes can be cleared of coating debris, but the process becomes difficult and time consuming requiring movement and reorientation of the laser for each hole
Solution Approach 1:
The patent segments the holes into multiple groups based on their spatial distribution and characteristics on the complex contoured surface. Each group is processed with optimized laser parameters specific to its location and geometry, allowing parallel or sequential processing without requiring physical movement of the laser device between holes.
Solution Approach 2:
The patent introduces a new dimension of processing by varying laser operating parameters (power, pulse width, frequency) and ablation patterns across different hole groups. This parameter space expansion allows the same laser device to efficiently clear diverse hole configurations without physical repositioning, transforming a spatial movement problem into a parameter optimization problem.
2Reliability
If the laser is moved and reoriented for each hole to clear debris, then all holes can be accessed, but the cutting device does not operate during the movement portion of the process increasing overall process inefficiency
Solution Approach 1:
The patent applies dynamics by continuously varying laser operating parameters and ablation patterns in real-time based on the specific characteristics of each hole group being processed. This dynamic parameter adjustment allows the laser to maintain optimal cutting efficiency across all holes without physical movement, keeping the laser continuously operative at full productivity.
Solution Approach 2:
The patent systematically changes laser parameters (power levels, pulse durations, repetition rates) and ablation patterns to match the specific requirements of different hole groups. This parameter adaptation enables complete hole coverage while maintaining continuous laser operation, eliminating idle movement time and maximizing part throughput.
3Productivity
If high power laser is used to clear numerous holes efficiently, then the process time is reduced, but thermal damage may occur to the substrate and coatings
Solution Approach 1:
The patent applies local quality by assigning different laser parameters and ablation patterns to different groups of holes based on their location, size, and surrounding material characteristics. This localized optimization allows high-power processing where appropriate while using lower power settings in thermally sensitive areas, achieving fast clearing without substrate damage.
Solution Approach 2:
The patent uses periodic action through pulsed laser operation with varied pulse widths and repetition rates for different hole groups. This periodic delivery of energy allows heat dissipation between pulses, preventing thermal accumulation and substrate damage while maintaining efficient material removal through high peak powers during active pulsing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and effort required to clear holes, enhances part throughput, and minimizes thermal damage to the substrate and coatings by allowing continuous operation with optimized laser parameters and patterns, improving the efficiency and effectiveness of the debris removal process.
Implementation Method 1
a laser configured to deliver laser beam pulses to at least one hole in a group of holes of an article
Implementation Method 2
ablates a first group of holes with a laser based on a first established ablation characteristic
Data Source
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AI summary
A method (600) of processing a group of holes (14) in an article (10) is provided. The method (600) includes an establishing step (602) that establishes an ablation characteristic including at least one of, a laser operating parameter and an ablation pattern for the group of holes. An ablating step (608) ablates a first group of holes with a laser (22) based on a first established ablation characteristic. A second ablating step (610) ablates a second group of holes with the laser (22) based on a second established ablation characteristic. The first established ablation characteristic is different from the second established ablation characteristic.