Laser Hole Formation in Electronic Modules Without Cracks
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Solution Overview
Problem
Existing methods for manufacturing electronic apparatuses do not effectively enhance the durability of electronic components, leading to potential issues such as crack formation and moisture ingress during the laser hole-forming process.
Innovation Solution
A method involving a laser beam is used to rotate along a moving path divided into sections, with the laser beam not emitted during the initial slower section to prevent damage, and then emitted during a faster section to efficiently remove the hole-forming area from the preliminary electronic module, forming a module hole without particles or cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the laser beam is emitted continuously during the entire rotation along the moving path, then the hole-forming area is efficiently removed, but cracks and particles are generated reducing component durability
Solution Approach 1:
The moving path is divided into a first section and a second section. The laser beam is emitted only during the second section after the laser source completes its first rotation, rather than continuously throughout the entire path. This segmentation allows the system to avoid crack-prone areas while efficiently removing material in safe zones, resolving the contradiction between productivity and reliability.
Solution Approach 2:
The laser source completes its first rotation without emitting the laser beam, allowing the laser source to reach optimal positioning and speed before material removal begins. This preliminary action prevents cracks from forming at the start of the cutting path, ensuring component durability while maintaining subsequent cutting efficiency.
2Speed
If the laser source moves at constant high speed along the moving path, then the manufacturing process is efficient, but the laser beam causes damage in certain sections
Solution Approach 1:
Different sections of the moving path are assigned different laser emission characteristics. The first section has no laser emission to prevent damage, while the second section receives laser emission for efficient material removal. This local differentiation allows high-speed operation throughout while preventing harmful effects in specific zones.
3Productivity
If the laser beam is emitted during the first rotation to maximize productivity, then material removal is faster, but cracks form reducing electronic component durability
Solution Approach 1:
The first rotation serves as a preliminary positioning phase where the laser source traverses the moving path without emitting the laser beam. This allows the system to establish proper cutting conditions and avoid crack-prone areas before actual material removal begins in the second rotation, maintaining both strength and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of the electronic panel by preventing cracks and moisture ingress, resulting in improved durability and reduced particle formation during the hole-forming process.
Implementation Method 1
emitting a laser beam while rotating a laser source along a moving path defined along a boundary between the hole-forming area and the active area
Data Source
AI summary
A method for manufacturing an electronic apparatus, includes: providing a preliminary electronic module including an active area having a hole-forming area, and a peripheral area adjacent to the active area; emitting a laser beam while rotating a laser source along a moving path defined along a boundary between the hole-forming area and the active area, the moving path being divided into a first section and a second section; and removing the hole-forming area from the preliminary electronic module to form an electronic module having a module hole. During a first rotation of the laser source along the moving path, the laser beam is not emitted on the first section, and the laser beam is emitted on the second section.