Laser Hole Formation on Foldable Display Panels
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Solution Overview
Problem
Foldable electronic apparatuses face durability issues due to varying stresses applied during repeated folding operations, which can damage components in areas with higher stress, leading to reduced reliability and potential structural weaknesses.
Innovation Solution
A method of manufacturing electronic apparatuses involves selectively irradiating a laser beam at different energy densities along defined paths on a foldable display panel to form holes, protecting components in areas subjected to greater stress by adjusting the laser beam's speed, power, and frequency, ensuring the formation of holes that enhance the apparatus's durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam is irradiated at uniform energy density across the active area, then the hole formation process is simple and fast, but components in high-stress areas are damaged due to excessive energy input
Solution Approach 1:
The patent applies local quality by dividing the active area into different zones (first areas and second areas) with different stress characteristics during folding, and irradiating each zone with different laser energy densities. Specifically, the first energy density is applied to first areas and the second energy density is applied to second areas, where the energy densities are different from each other. This allows the hole formation process to be optimized for each local region's stress conditions, preventing component damage in high-stress areas while maintaining efficient hole formation.
2Manufacturing precision
If the laser beam energy density is increased to ensure complete hole formation, then hole formation reliability improves, but components in high-stress areas are damaged
Solution Approach 1:
The patent implements local quality by differentiating the laser energy density applied to different regions of the active area based on their stress characteristics during folding operations. The first areas receive a first energy density while the second areas receive a second energy density, with the energy densities being different from each other. This localized approach ensures that each region receives the appropriate energy level for complete hole formation without causing damage to components in high-stress areas.
Solution Approach 2:
The patent applies parameter changes by varying the laser beam's energy density parameter across different regions of the active area. The energy density is changed from a uniform value to differentiated values (first energy density and second energy density) based on the stress characteristics of different areas during folding. This parameter modification allows complete hole formation while preventing component damage in stress-sensitive regions.
3Manufacturing precision
If the laser beam moves slowly along the hole formation boundary to ensure precise hole formation, then hole shape accuracy improves, but the manufacturing time increases
Solution Approach 1:
The patent applies local quality by differentiating the laser processing approach between the hole formation boundary and the interior areas. Along the boundary (first paths), the laser is irradiated at a first energy density to ensure precise hole shape formation. In the interior areas (second paths), the laser is irradiated at a second energy density to ensure complete material removal. This localized differentiation achieves both accurate hole shapes and complete hole formation without requiring uniformly slow processing throughout the entire area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the durability and reliability of electronic apparatuses by specifically addressing stress variations, thereby reducing the risk of damage and enhancing the structural integrity of components in high-stress areas.
Implementation Method 1
selectively irradiating a laser beam along a path defined along a boundary between the hole formation area and the active area... at a first energy density and at second energy density different from the first energy density... forming a set module having a hole by removing the hole formation area
Data Source
AI summary
A method includes: providing an unfinished set module for a display panel having an active area and a peripheral area adjacent to the active area and being foldable about a foldable axis extending in one direction, the active area including a hole formation area; selectively irradiating a laser beam along a path defined along a boundary between the hole formation area and the active area, the path including first paths spaced apart from each other in a direction substantially parallel to the foldable axis and second paths disposed between the first paths, at a first energy density and at second energy density different from the first energy density, wherein the laser beam is irradiated at the first energy density along the first paths and at the second energy density along the second paths; and forming a set module having a hole by removing the hole formation area from the unfinished set module.