Laser-ignited reactive HAMR bonding stack
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Solution Overview
Problem
Existing heat-assisted magnetic recording (HAMR) head bonding methods require external energy sources for solder melting, leading to slow bonding processes, potential component damage, and increased costs due to the need for additional heating apparatus.
Innovation Solution
The implementation of a self-propagating multilayer alloying stack using reactant metals like nickel and aluminum, which generates heat through an exothermic reaction, reducing the reliance on external energy sources and allowing the light source already used for alignment to provide the necessary ignition energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external heating mechanisms (chuck heaters, laser heating, pin probes) are used to melt solder, then bonding can be achieved, but the bonding process becomes slow and requires additional complex apparatus
Solution Approach 1:
The solder joint itself serves as the heating element through resistive heating. The solder material's own electrical resistance converts electrical energy directly into heat at the bonding interface, eliminating the need for external heating mechanisms such as chuck heaters, laser heating systems, or pin probe heating apparatus.
Solution Approach 2:
The solder material performs dual functions: it provides the bonding function by melting and joining surfaces, and simultaneously serves as the heating element through its electrical resistance. This eliminates the need for separate heating apparatus and simplifies the overall bonding system.
2Productivity
If higher temperatures are used to accelerate solder melting through conduction, then bonding speed increases, but thermal damage risk and misalignment increase
Solution Approach 1:
Heating is localized precisely at the solder joint interface where electrical current passes through the solder material. The heat is generated only where needed for bonding, rather than heating the entire component or chuck, thus avoiding thermal damage and misalignment while achieving fast bonding speed.
Solution Approach 2:
The mechanical/conductive heating system (chuck heaters, external lasers) is replaced with an electrical heating mechanism where current directly passes through the solder material to generate heat at the bonding interface through Joule heating, enabling precise localized heating without thermal damage.
3Reliability
If full bonding energy is supplied externally, then bonding can be achieved, but additional heating components are required increasing cost and complexity
Solution Approach 1:
The solder joint provides its own heating function through resistive heating. The electrical energy required for bonding is delivered directly through the solder material itself, which converts the energy into heat at the bonding interface, eliminating the need for external heating components and simplifying manufacturing.
Solution Approach 2:
The electrical parameters (current, voltage) are optimized to utilize the solder material's electrical resistance as the heating mechanism. By controlling the electrical parameters, the solder material's inherent resistance provides the necessary heating for bonding without requiring additional heating components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster, cheaper, and more reliable bonding by minimizing the energy requirements and eliminating the need for external heating components, thus reducing thermal risks and improving bond speed and alignment precision.
Implementation Method 1
a self-propagating multilayer alloying stack using reactant metals like nickel and aluminum, which generates heat through an exothermic reaction
Implementation Method 2
allowing the light source already used for alignment to provide the necessary ignition energy
Data Source
AI summary
The present disclosure generally relates to a HAMR head and a method for fabrication thereof. The HAMR head has a write head with a waveguide extending therethrough. A laser diode is coupled to a submount that is bonded to the write head using an adhesion layer, a solder structure, and a self-propagating multilayer alloying stack.