Laser Processing Imaging for Fast Irradiation Condition Tuning
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Solution Overview
Problem
Current laser processing methods require time-consuming adjustments of irradiation conditions and cross-section observation to achieve desirable results, making it difficult to efficiently adjust laser light conditions for unknown objects.
Innovation Solution
A laser processing device and method that irradiates an object with laser light along multiple lines under different conditions, capturing images with transmitted light to associate irradiation conditions with formation states without reaching the object's surface, facilitating the adjustment of laser light conditions without the need for cutting or cross-section observation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser processing is performed under multiple irradiation conditions with cross-section observation to adjust conditions, then processing accuracy can be improved, but adjustment time increases significantly
Solution Approach 1:
The patent uses optical imaging to create a visual copy of the modified region's projection on the object's surface. This optical copy allows operators to observe processing results without physical cross-sectioning, enabling rapid condition adjustment while maintaining processing accuracy.
Solution Approach 2:
The patent replaces the mechanical cross-section observation method with an optical imaging system. Instead of physically cutting and observing sections, the system uses light to project and capture images of the modified region's position, eliminating time-consuming mechanical preparation while maintaining observation accuracy.
2Reliability
If cross-section observation is used to verify modified region formation, then processing quality can be confirmed, but the process becomes complex and requires advanced know-how
Solution Approach 1:
The optical imaging system creates a two-dimensional projection copy of the three-dimensional modified region. This copy provides sufficient information to verify processing quality without requiring complex cross-section preparation and observation procedures, reducing the need for advanced know-how.
Solution Approach 2:
The patent introduces an optical imaging system as an intermediary between the laser processing unit and the observation system. This intermediary converts the modified region's physical state into optical information that can be easily captured and analyzed, simplifying the verification process while maintaining reliability.
3Measurement precision
If multiple irradiation conditions are tested with cross-section analysis, then optimal conditions can be identified, but the adjustment process becomes time-consuming
Solution Approach 1:
The optical imaging system rapidly captures projection images of modified regions under different irradiation conditions. This copying method enables quick comparison and analysis of multiple conditions without the time penalty of repeated cross-section preparation, maintaining measurement precision while improving adjustment efficiency.
Solution Approach 2:
The patent enables continuous observation and comparison of processing results under multiple irradiation conditions. By eliminating the interruptive cross-section preparation steps, the system maintains continuous productive action, allowing rapid identification of optimal conditions without sacrificing measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for rapid and precise adjustment of laser light conditions, improving the efficiency of laser processing by eliminating the need for time-consuming adjustments and observations, thereby enhancing processing efficiency and accuracy.
Implementation Method 1
a laser light source that emits processing laser light for forming a modified region in the wafer
Implementation Method 2
capturing an image of the object with light having transparency to the object
Data Source
AI summary
A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object, and a control unit configured to control at least the irradiation unit and the image capturing part. A plurality of lines is set in the object. The control unit performs a first process of irradiating the object with the laser light for each of the plurality of lines by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object.