Laser Insulating Layer Removal for Electronic Component Electrodes
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Solution Overview
Problem
The existing manufacturing method for electronic components, which covers all surfaces with an insulating layer except the bottom surface, struggles with controlling the removal of the insulating layer to expose desired regions of outer electrodes, leading to potential short-circuiting and inability to form electrodes into specific shapes.
Innovation Solution
A method involving the application of laser light to selectively remove the insulating layer in predetermined regions, utilizing a metal plated layer with a higher absorption coefficient than the outer electrode material to prevent damage to the electrodes, allowing for the formation of desired shapes and preventing short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the insulating layer is removed by using a grinding wheel, then the insulating layer can be removed, but the amount of insulating layer to be removed is difficult to control and outer electrodes positioned inward may also be removed
Solution Approach 1:
The patent replaces the mechanical grinding wheel system with a laser beam system to remove the insulating layer. The laser beam selectively removes the insulating layer through thermal ablation without mechanical contact, enabling precise control of the removal amount and preventing damage to the outer electrodes positioned inward.
Solution Approach 2:
The patent changes the physical state and properties by using laser energy to heat and vaporize the insulating layer material. By controlling laser parameters (power, speed, pulse duration), the removal process achieves high precision without affecting the underlying electrodes, resolving the control difficulty of mechanical grinding.
2Ease of manufacture
If the bottom surface is entirely exposed for mounting, then bonding to mounting substrate is enabled, but the exposed regions of outer electrodes cannot be formed into a desired shape
Solution Approach 1:
The patent applies local quality by selectively removing the insulating layer only in specific predetermined regions where electrode exposure is needed, while maintaining the insulating layer in other regions. This allows the exposed electrode regions to be formed into desired shapes for both mounting bonding and preventing short-circuiting between adjacent electrodes.
3Reliability
If surfaces are covered with insulating layer to prevent short-circuiting, then reliability is improved, but the ability to form electrodes into desired shapes is reduced
Solution Approach 1:
The patent maintains the insulating layer covering most surfaces to prevent short-circuiting, while selectively removing it in predetermined regions where electrode shape control is needed. This local differentiation allows both reliability through insulation and shape control through selective exposure to be achieved simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of electronic components with exposed outer electrodes in desired shapes, ensuring reliable electrical and mechanical bonding while preventing short-circuiting, thereby enhancing the manufacturing process for high-density electronic component mounting.
Implementation Method 1
the insulating layer having a higher absorption coefficient for the laser light than that of a material constituting a surface of the outer electrode body
Implementation Method 2
removing the insulating layer located in a predetermined region of the outer electrode body so as to expose the predetermined region by applying laser light to the insulating layer in the predetermined region
Data Source
AI summary
A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.