Laser-Assisted Interconnect Bonding to Reduce Warpage
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Solution Overview
Problem
Conventional semiconductor packaging methods result in high costs, decreased reliability, and large package sizes, leading to inefficiencies in electronic device manufacturing.
Innovation Solution
The use of laser-assisted bonding (LAB) tools and hybrid bonder tools that combine laser and thermal/compression bonding techniques to efficiently bond semiconductor devices, allowing for precise control of heat application and interconnect bonding, thereby reducing warpage and improving bonding quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packaging methods are used, then manufacturing process is simple, but cost is high and reliability is decreased
Solution Approach 1:
The patent replaces conventional mechanical bonding methods with laser-assisted bonding, where a laser beam heats the interconnect material to enable bonding. This substitution of mechanical processes with optical/thermal processes improves bonding reliability while maintaining manufacturing feasibility through automated laser systems.
Solution Approach 2:
The patent changes the bonding parameters by using localized laser heating to achieve precise temperature control at the bonding interface. By controlling laser power, duration, and focal point, the process achieves reliable bonding without excessive heat affecting the entire device, thus improving reliability while managing manufacturing complexity.
2Volume of moving object
If conventional packaging methods are used, then process is straightforward, but package size is large
Solution Approach 1:
The patent applies localized laser heating only at the specific bonding interface between the interconnect and substrate, rather than heating the entire package. This localized approach enables precise bonding with minimal thermal affect on surrounding areas, reducing overall package size while maintaining manufacturing feasibility.
Solution Approach 2:
By replacing conventional mechanical compression bonding with laser-assisted bonding, the process achieves stronger, more reliable bonds in smaller volumes. The laser energy is concentrated at the bonding interface, enabling compact package design without sacrificing manufacturing capability.
3Strength
If conventional bonding methods are used, then equipment is simple, but bonding strength is insufficient
Solution Approach 1:
The patent replaces mechanical bonding systems with laser-assisted bonding equipment. The laser beam provides concentrated thermal energy that creates strong metallurgical bonds in the interconnect material, achieving superior bonding strength. The equipment complexity is managed through integrated laser systems with automated positioning and control.
Solution Approach 2:
The patent changes the bonding mechanism by using controlled laser parameters (power, pulse duration, focal position) to achieve optimal bonding strength. By adjusting these parameters, the process creates strong, reliable interconnect bonds without requiring excessively complex equipment configurations.
4Ease of manufacture
If traditional packaging methods are used, then production process is simple, but production cost is high
Solution Approach 1:
The patent replaces traditional mechanical bonding processes with laser-assisted bonding, which reduces material waste and improves bonding efficiency. The laser process requires less auxiliary material and produces fewer defects, reducing rework costs. While laser equipment has higher upfront cost, the overall production cost decreases through improved yield and faster processing.
Solution Approach 2:
The patent employs an inert or controlled atmosphere during laser bonding to prevent oxidation and contamination of the bonding interface. This controlled environment reduces defect rates and rework requirements, lowering overall production costs despite the added complexity of atmosphere control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and performance of semiconductor devices by achieving strong, reliable interconnects while minimizing package size and production costs, thereby improving manufacturing efficiency.
Implementation Method 1
heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure
Data Source
AI summary
In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.