Laser Interconnection for Organic Photovoltaic Devices
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Solution Overview
Problem
The challenge in organic photovoltaic (OPV) devices is the inefficiency due to series resistance in large-area devices, which arises from thin film electrodes, and the complex, time-demanding patterning processes required for interconnections between solar cells, reducing the surface area exposed to light and increasing production complexity.
Innovation Solution
A method for forming electrical interconnections in OPV devices using a laser process through the encapsulation, eliminating the need for shadow masks, with aligned interconnections created in a maskless deposition process, allowing for efficient series connection of solar cells without vacuum or inert atmosphere requirements, and enabling large-area device production with enhanced efficiency and reduced material consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If shadow masks are used for patterning interconnections, then alignment accuracy is improved, but device complexity and production time increase
Solution Approach 1:
The patent removes the shadow mask component entirely from the system. Instead of using physical masks for patterning, the invention employs direct laser writing methods that deposit conductive material precisely where needed without requiring masking layers, thereby eliminating the complexity associated with mask alignment and handling while maintaining patterning accuracy
Solution Approach 2:
The patent replaces the mechanical shadow mask system with an optical/laser-based direct writing system. The laser beam directly writes the interconnection patterns by depositing conductive material through photomasking or direct laser-induced deposition, substituting mechanical mask manipulation with optical field control for pattern formation
2Power
If series connections are made between solar cells, then voltage is increased to reduce series resistance effects, but the surface area exposed to light is reduced
Solution Approach 1:
The patent transitions from planar series connections that require lateral spacing to three-dimensional vertical interconnections. By depositing conductive material through the encapsulation layer from the rear side, the interconnections are formed in the vertical dimension rather than consuming horizontal light-receiving area, effectively adding a spatial dimension to the connection architecture
Solution Approach 2:
The patent introduces the encapsulation layer as an intermediary medium that allows laser-written conductive paths to traverse through it, enabling electrical connections between cells without requiring direct lateral contact between electrodes. This intermediary approach permits vertical penetration for interconnection while preserving the horizontal light-exposed surface
3Loss of substance
If thin film electrodes are used, then material consumption is reduced, but series resistance increases
Solution Approach 1:
The patent creates composite conductive structures by writing through multiple layers (encapsulation, active layer, electrode) to form interconnected conductive paths. The laser-induced conductive trails create composite material pathways that combine the properties of the encapsulation material, active layer, and electrode material, achieving low resistance connections while maintaining thin film architecture
Solution Approach 2:
The patent performs preliminary laser writing of conductive patterns through the encapsulation layer before final device assembly or testing. This preliminary action creates the conductive interconnection framework in advance, ensuring low series resistance pathways are established before the device is fully operational, allowing thin film electrodes to be used without compromising electrical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of large-area OPV devices with maximum area utilization, simplifies the production process, reduces maintenance and material consumption, and increases output speed, while providing efficient electrical connections that minimize series resistance and maintain high power performance.
Implementation Method 1
the step of providing the electrical interconnection comprises laser writing of a conductive trail through the encapsulation, the active layer and the electrode to the adjacent solar cell in series
Data Source
Figure 1
Figure 2
Figure 3a~3c
AI summary
The present invention concerns a method for forming an electrical interconnection in an organic photovoltaic device, the method comprising steps of providing a first conductive layer (31), providing an organic photovoltaic layer (32), over the first conductive layer, providing a second conductive layer (33), over the organic photovoltaic layer, and providing an electrical interconnection between the first conductive layer and the second conductive layer.