Laser-Formed Interconnects for Redundant Display Circuits
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Solution Overview
Problem
Existing display systems lack reliable solutions for addressing faults in both light emitters and control circuits, particularly in active-matrix circuits, leading to manufacturing yield and performance issues due to the inability to effectively handle faulty or missing control elements.
Innovation Solution
A parallel redundant integrated-circuit system is introduced, featuring redundant circuits with the same functionality on separate substrates, connected in parallel without additional interconnections for control or test circuits, allowing for fault tolerance and simple construction and operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If redundant circuits are added to handle faulty control elements, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent divides the control circuit into multiple independent redundant circuits, where each circuit can independently control a light emitter. This segmentation allows the system to maintain functionality even when one circuit fails, thereby improving reliability without requiring a completely new system architecture.
Solution Approach 2:
The patent changes the operational parameter by enabling multiple circuits to share control of a single light emitter through calibration. By adjusting the calibration parameters of redundant circuits, the system achieves reliable operation with simpler interconnections, as the circuits can be dynamically activated or deactivated based on functionality rather than requiring permanent dedicated connections.
2Difficulty of detecting and measuring
If additional interconnections for control or test circuits are added, then fault detection capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent makes the interconnections universal by designing them to serve multiple functions simultaneously. The same interconnection structure is used for both normal operation and fault detection, eliminating the need for separate dedicated test circuits. This multi-functionality reduces manufacturing complexity while maintaining fault detection capability.
Solution Approach 2:
The redundant circuits perform self-testing and self-diagnosis through their normal operational interconnections. By monitoring the functionality of each circuit during operation, the system automatically detects faults without requiring external test equipment or additional complex testing infrastructure, thereby simplifying manufacturing.
3Ease of manufacture
If redundant circuits are implemented without additional interconnections, then ease of manufacture is improved, but control capability may be limited
Solution Approach 1:
The patent introduces dynamic control capability where redundant circuits can be selectively activated or deactivated based on their functionality. This dynamic adaptation allows the system to maintain full control capability over light emitters even with simplified static interconnections, as the control architecture can reconfigure itself in response to circuit functionality.
Solution Approach 2:
The patent uses calibration parameters to dynamically adjust the operational characteristics of redundant circuits. By changing calibration parameters, the system can optimize the control capability of available circuits and compensate for the reduced interconnection complexity, maintaining adaptability while simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and manufacturing yields of display systems by enabling continued operation even if one active circuit fails, ensuring consistent light output through calibration and redundancy, thereby improving overall system robustness and reducing defects.
Implementation Method 1
A laser is used to form an electrical interlayer connection
Implementation Method 2
melting a conductive material at a bond interface
Implementation Method 3
fusing materials at the bond interface
Data Source
AI summary
A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.