Laser Interference Structuring for Optoelectronic Cast Surface Gloss Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for manufacturing optoelectronic components with roughened cast surfaces do not effectively suppress specular reflection, which is crucial for display screens in bright environments, especially for dark or black displays to avoid gloss effects.

Innovation Solution

A method involving a carrier with an optoelectronic semiconductor chip embedded in a casting material, where a portion of the casting material is removed using laser interference structuring to create a topography at the cast surface, scattering electromagnetic radiation diffusely and reducing gloss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional etching methods (wet chemical etching, dry etching, spray etching) are used to roughen the cast surface, then the surface can be modified to reduce gloss, but the process complexity increases and harmful chemicals are required

Engineering Contradiction:
Improveharmful chemicalsVSAvoidetching process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent replaces chemical etching methods (wet chemical etching, dry etching, spray etching) with a mechanical/physical method: laser interference structuring. The laser creates an interference pattern on the cast surface that directly removes material through ablation, eliminating the need for chemical etchants and complex chemical processing equipment while achieving the same surface roughening effect.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental parameter of the etching process from chemical (using etchants) to optical/physical (using laser interference). By utilizing the interference pattern of laser light, the method achieves precise material removal through controlled ablation, transforming the process from a chemical reaction-based approach to a physics-based approach that avoids harmful chemicals.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If the cast surface is left smooth, then the manufacturing process is simple, but specular reflection occurs which is harmful for display screens in bright environments

Engineering Contradiction:
Improvespecular reflectionVSAvoidsurface treatment complexity
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent applies laser interference structuring during the casting process itself, before the component is fully manufactured and assembled. The cast surface is roughened in advance while the casting material is still in place, creating the anti-gloss effect proactively rather than requiring additional post-processing steps later in the manufacturing sequence.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces complex multi-step surface treatment processes (such as spray etching, immersion etching, or dry etching) with a single laser interference structuring step. The laser method directly creates the required surface topography through optical interference and ablation, simplifying the manufacturing process while effectively eliminating specular reflection.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If multiple etching methods are considered to achieve surface roughening, then various approaches are available, but the selection and implementation becomes more difficult

Engineering Contradiction:
Improveetching method optionsVSAvoidprocess selection difficulty
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The patent extracts and eliminates the need to choose between multiple etching methods (wet chemical, dry, spray) by adopting a single superior method: laser interference structuring. This approach removes the decision-making complexity associated with selecting and implementing different etching techniques, as the laser method provides a universal solution that works for various casting materials and component types.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively suppresses specular reflection and reduces gloss, allowing for improved display performance in bright environments by diffusely scattering incoming radiation, and can be implemented using various etching techniques without harmful chemicals.

Implementation Method 1

at least two laser beams are directed onto the cast surface (41), wherein an interference pattern is generated on the cast surface (41) through interference of the laser beams

Methodology Applied
Scientific EffectLaser interference: Interference

Implementation Method 2

A portion of the casting material is removed at the cast surface through laser interference structuring

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS11038090B2Method of producing an optoelectronic component
Publication Date: 2021.06.15 AMS OSRAM INT GMBH
  • US11038090B2 patent drawing
  • US11038090B2 patent drawing
  • US11038090B2 patent drawing

AI summary

A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.