Laser Interferometer Alignment for Sub-Micron Semiconductor Bonding
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Solution Overview
Problem
The challenge in semiconductor bonding is achieving high accuracy in the bonding process, which is crucial for three-dimensional integration of chips, as existing technologies struggle to precisely align and bond semiconductor materials effectively.
Innovation Solution
A bonding apparatus equipped with a laser interferometer assembly to determine displacement information along multiple directions, combined with image acquisition members to read alignment marks and define a calibrated coordinate system, allowing precise alignment and bonding of semiconductor components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional alignment methods are used, then the bonding process can be completed, but the bonding accuracy is insufficient for high-precision three-dimensional integration
Solution Approach 1:
The patent replaces conventional mechanical alignment methods with a laser interferometer-based measurement system. The laser interferometer assembly emits laser beams that reflect off the semiconductor wafer surfaces to precisely measure displacement and position information, enabling sub-micron alignment accuracy that mechanical methods cannot achieve.
Solution Approach 2:
The patent introduces alignment marks as intermediary reference features on the semiconductor wafer surfaces. These alignment marks serve as mediators between the measurement system and the wafer, allowing the laser interferometer to accurately determine wafer position and orientation by detecting the alignment marks' coordinates rather than directly measuring the wafer edges.
2Manufacturing precision
If high-precision alignment is implemented, then bonding accuracy improves, but the device complexity increases due to additional measurement systems
Solution Approach 1:
The laser interferometer assembly is designed to perform multiple functions: it measures displacement information, determines coordinate information of alignment marks, and provides positioning data for the movable platform. This multi-functional design reduces the need for separate measurement devices, thereby limiting the increase in device complexity while achieving high bonding accuracy.
3Measurement precision
If coordinate calibration is performed using alignment marks, then positioning accuracy is improved, but the measurement and detection difficulty increases
Solution Approach 1:
The patent performs preliminary calibration by determining the coordinate information of alignment marks on the wafer surface before the actual bonding process. This preliminary measurement establishes a reference coordinate system that simplifies subsequent positioning operations, making the overall measurement process more manageable despite the initial complexity of detecting alignment mark coordinates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances bonding accuracy with sub-micron precision, ensuring effective integration of semiconductor materials by accurately positioning and aligning components in a calibrated coordinate system.
Implementation Method 1
a laser interferometer assembly including: a first laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a first direction; and a second laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a second direction
Data Source
AI summary
A bonding apparatus and a bonding method are provided. The bonding apparatus includes: a machine base, including a movable pick-up platform; and a laser interferometer assembly. The laser interferometer assembly includes: a first laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a first direction; and a second laser interferometer unit, configured to determine displacement information of the movable pick-up platform along a second direction. Based on the displacement information along the first direction and the displacement information along the second direction, the laser interferometer assembly is further configured to determine coordinate information of the movable pick-up platform.