Semiconductor Laser Laminate Mounting With Recessed Support Body
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Solution Overview
Problem
Existing semiconductor manufacturing methods face difficulties in handling miniaturized semiconductor laser elements due to challenges in mounting and processing components with short resonator lengths and chip widths, which affects manufacturing efficiency and reliability.
Innovation Solution
A manufacturing method involving the preparation of laminate bodies with short resonator lengths and chip widths, where the laminate bodies are bonded to a support structure with recessed portions to facilitate the formation of dielectric layers on end surfaces, improving handling and light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If semiconductor laser elements are miniaturized to achieve short resonator lengths and chip widths, then light emission performance and device integration are improved, but handling difficulty and manufacturing reliability deteriorate
Solution Approach 1:
The support substrate is divided into multiple recessed portions, each accommodating a miniaturized semiconductor laser element. This segmentation allows individual handling and positioning of each element while maintaining overall structural integrity, resolving the handling difficulty caused by miniaturization
Solution Approach 2:
The semiconductor laser elements are nested within the recessed portions of the support substrate. This nesting structure provides mechanical support and protection to the miniaturized elements, improving handling reliability without compromising the short resonator length design
2Area of moving object
If semiconductor laser elements are miniaturized with short resonator lengths, then device integration density is improved, but mounting difficulty and manufacturing complexity increase
Solution Approach 1:
The support substrate is designed with localized recessed portions that provide tailored mechanical support specifically where the miniaturized semiconductor laser elements are mounted. This local structural adaptation simplifies the mounting process by providing pre-configured positioning features that accommodate the small chip width elements
Solution Approach 2:
The recessed portions are pre-formed in the support substrate before the semiconductor laser elements are mounted. This preliminary preparation of the mounting structure simplifies the subsequent assembly process, making it easier to handle and mount the miniaturized elements with short resonator lengths
3Illumination intensity
If dielectric layers are formed on end surfaces of miniaturized elements, then light emission efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The recessed portions in the support substrate provide a cushioning effect that stabilizes the miniaturized semiconductor laser elements during the dielectric layer formation process. This mechanical support compensates for the difficulty in precisely forming dielectric layers on the small end surfaces, reducing the stringency of manufacturing precision requirements while maintaining high light emission efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient manufacturing of semiconductor devices with short resonator lengths and chip widths, enhancing manufacturing efficiency, light emission performance, and reliability by allowing precise dielectric layer formation and improved mechanical handling.
Implementation Method 1
bonding and disposing the laminate body to the upper surface of the first support body
Data Source
AI summary
A manufacturing method for a semiconductor device according to the present disclosure includes preparing a laminate body including a plurality of semiconductor layers, and a first support body including an upper surface, a side surface, and a recessed portion including an opening adjacent to the upper surface and the side surface, bonding and disposing the laminate body to the upper surface of the first support body, forming a first end surface at the laminate body, and forming a first dielectric layer on the first end surface.