Laser-Patterned Lamination Structure Without Barrier Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional lamination structures in semiconductor manufacturing require complex photolithography processes, which are costly and can damage underlying layers or components when using laser direct structuring due to the need for barrier layers.
Innovation Solution
A lamination structure is formed with a substrate, a first metal pattern layer, and a second metal pattern layer, where the second layer has rounded corners and is patterned using laser processing followed by wet etching, omitting the need for photolithography and preventing laser damage to underlying layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography process is used to pattern metal layers, then manufacturing precision is improved, but device complexity and manufacture cost increase
Solution Approach 1:
The patent extracts and removes the photolithography process steps (mask preparation, coating, exposure, development) from the manufacturing flow, replacing them with direct laser patterning that achieves the same patterning result with fewer process steps, thereby reducing device complexity while maintaining precision
Solution Approach 2:
The patent replaces the mechanical/chemical photolithography system with a laser-based direct structuring system, where laser energy directly patterns the metal layer without requiring masks or chemical developers, simplifying the overall manufacturing process
2Device complexity
If laser direct structuring is used to pattern metal layers, then device complexity is reduced, but harmful factors increase due to laser penetration damage
Solution Approach 1:
The patent applies local quality by giving different properties to different parts of the lamination structure: the top metal layer has high laser absorptivity for effective patterning, while the molding layer has low laser absorptivity to prevent penetration and damage to underlying components, thus enabling laser processing without harmful effects
Solution Approach 2:
The molding layer acts as an intermediary between the laser beam and the underlying semiconductor components. It absorbs or blocks excess laser energy, preventing the laser from penetrating through and damaging sensitive components below, thus mediating the interaction between laser and substrate
3Object-affected harmful factors
If barrier layer is added to prevent laser penetration, then harmful factors are reduced, but device complexity and manufacture cost increase
Solution Approach 1:
The patent makes the molding layer multi-functional: it serves both as the structural molding compound encapsulating the semiconductor device and as a laser protection layer that prevents laser penetration. This eliminates the need for a separate barrier layer, reducing structure complexity while maintaining protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process, reduces costs, and protects underlying layers and components from laser damage by using laser processing and wet etching to form rounded corners.
Implementation Method 1
a laser micro-processing technique using laser direct structuring (LDS) (may be referred as laser engraving) to pattern one or more layers
Implementation Method 2
the opening pattern is formed by performing wet etching on the metal layer where the laser processing has been performed
Data Source
AI summary
A lamination structure including a substrate, a first metal pattern layer, a molding layer and a second metal pattern layer. The first metal pattern layer is formed on the substrate. At least a part of the molding layer and the first metal pattern layer are located on a layer. The second metal pattern layer is formed on the first metal pattern layer and has an opening pattern exposing the molding layer. The second metal pattern layer has a top part and a bottom part that are opposite to each other. The top part and the bottom part each have a rounded corner on an edge adjacent to the opening pattern.