Laser Crystal Lattice Slicing for Low-Waste Solid Separation
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Solution Overview
Problem
Traditional methods for separating solids, such as sawing and laser-based separation, result in material waste, thickness variations, surface grooves, high costs, and imprecise crystal lattice modifications, especially when dealing with large or thick solids.
Innovation Solution
A method involving the use of a modifying agent, like a pico- or femtosecond laser, to modify the crystal lattice of a solid by generating modifications that cause subcritical cracks, allowing for precise separation without orthogonal cutting, reducing the need for post-processing, and minimizing material loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sawing is used to separate solids, then separation is achieved, but material waste in the form of chips occurs and surface grooves are formed
Solution Approach 1:
The patent replaces the mechanical sawing system with a laser-based modification system. Instead of using a physical saw blade that contacts and removes material, the invention uses laser beams to modify the crystal lattice structure, inducing subcritical cracks that propagate to separate the solid. This substitution eliminates mechanical contact, preventing both material waste in the form of chips and surface groove formation.
Solution Approach 2:
The invention changes the physical state and structure of the material through laser-induced crystal lattice modifications. By controlling laser parameters (pulse duration, energy density, scanning speed) to create specific modifications in the crystal lattice, the process transitions from mechanical removal to controlled structural transformation, achieving separation without material loss or surface degradation.
2Manufacturing precision
If traditional laser heating is used to generate internal stresses, then separation can be achieved, but the solid warps or expands unintentionally and crystal lattice modifications become imprecise
Solution Approach 1:
The patent employs picosecond or femtosecond laser pulses, which are extremely short periodic bursts of energy. These ultra-short pulses modify the crystal lattice before significant heat diffusion can occur, allowing precise localized modifications without the thermal accumulation that causes warping or expansion. The periodic pulsed action enables controlled modification while minimizing thermal damage.
Solution Approach 2:
The invention fundamentally changes the temporal parameter of laser energy delivery from continuous or long-pulse heating to ultra-short picosecond/femtosecond pulses. This parameter change transforms the interaction mechanism from thermal heating to non-thermal or minimally thermal lattice modification, achieving precise crystal lattice changes without the unwanted thermal deformation associated with traditional laser heating methods.
3Productivity
If laser beams penetrate the entire radius of the solid, then separation can be achieved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent applies laser modifications locally at specific positions within the solid rather than penetrating the entire radius uniformly. By creating localized crystal lattice modifications at strategically chosen positions, the process induces crack propagation that achieves separation without requiring comprehensive full-radius laser penetration. This local approach simplifies the device and reduces processing time while maintaining separation effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables defined and efficient separation of solids with minimal material waste and thermal deformation, achieving precise crack propagation and controlled detachment zones.
Implementation Method 1
modifying the crystal lattice of the solid by means of a modifying agent, in particular a laser, in particular a pico- or femtosecond laser, wherein the modifications, in particular the laser beams, penetrate the solid via a surface of the solid portion to be detached
Implementation Method 2
wherein several modifications are generated in the crystal lattice, wherein the crystal lattice, as a result of the modifications, tears in at least one portion, in particular subcritically, in the regions surrounding the modifications
Data Source
Figure 1
Figure 2a~2c
Figure 3a~3b
AI summary
The invention relates to a method for generating a detachment zone (2) in a solid (1), in particular for dividing the solid (1) along the detachment zone (2), wherein the solid portion (12) to be detached is thinner than the solid (1) reduced by the solid portion (12). According to the invention, the method preferably comprises at least the following steps: modifying the crystal lattice of the solid (1) by means of a modifier, in particular by means of at least one laser, especially a pico- or femtosecond laser, wherein the modifications, in particular the laser beams, penetrate the solid (1) via a surface (5) of the solid portion (12) to be detached, wherein several modifications (9) are generated in the crystal lattice, wherein the crystal lattice tears in at least one portion in the regions surrounding the modifications (9) as a result of the modifications (9).