Laser Crystal-Lattice Detachment for Lossless Solid Layer Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for separating solid bodies, such as sawing, result in material loss, increased thickness with multiple saw passes, surface damage, and high material and rework costs. Additionally, thermal methods like laser separation lead to high temperatures causing unintended solid expansion and imprecision in crystal grid modifications.
Innovation Solution
A procedure involving the use of laser radiation to create a transfer area within a solid by penetrating the laser beams above the surface to be separated, generating high temperatures that induce material modifications without local destruction of the crystal grid, allowing for controlled weakening or separation of solid layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If sawing is used to separate solid bodies, then separation can be achieved, but material loss occurs in the form of chips and surface damage is caused
Solution Approach 1:
The patent replaces the mechanical sawing system with a laser-based system that uses optical energy to induce material transformations. The laser creates modifications in the crystal lattice through controlled heating, which then propagate cracks along desired separation lines without mechanical contact, thereby eliminating chip generation and surface damage from saw blades
Solution Approach 2:
The laser induces phase transitions in the material by heating it to temperatures that cause modifications in the crystal lattice. These phase transitions create controlled weaknesses that lead to clean separation without material loss, as the material transforms rather than being mechanically removed
2Manufacturing precision
If multiple saw passes are used to separate thick solid bodies, then separation can be achieved, but thickness variation increases
Solution Approach 1:
The laser-based system replaces multiple mechanical saw passes with a single non-contact process. The laser can penetrate and create modifications throughout the material volume, enabling separation of thick solid bodies in one operation rather than requiring multiple passes, thereby maintaining thickness uniformity while improving productivity
Solution Approach 2:
The patent transitions from surface-level mechanical cutting to volumetric modification by introducing laser energy into the material's interior. This allows the separation process to act throughout the material's thickness simultaneously rather than incrementally from the surface, enabling single-pass separation of thick materials with uniform thickness
3Manufacturing precision
If high temperatures are applied to achieve material separation, then separation can be achieved, but unintended solid expansion and distortion occur
Solution Approach 1:
The laser applies heat locally and selectively to specific regions where modifications are desired, rather than heating the entire solid body. This localized heating creates controlled modifications in the crystal lattice at targeted locations without causing overall thermal expansion or distortion of the material, maintaining shape precision while achieving separation
Solution Approach 2:
The laser creates preliminary modifications in the crystal lattice at the separation line before actual separation occurs. These pre-created weaknesses guide subsequent crack propagation along the desired path, ensuring precise separation without requiring high temperatures that would cause material distortion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise separation of solid layers without material loss, reduces thermal-induced deformations, and allows for the separation of large and thick solid bodies, thereby minimizing costs and improving processing efficiency.
Implementation Method 1
exposing the solid body to laser radiation from the laser light source, wherein the laser beams penetrate into the solid body via a surface of the solid body portion to be separated, wherein the laser radiation applies defined radiation to a predetermined portion of the solid body inside the solid body
Implementation Method 2
the temperature generated in the predetermined portion of the solid body is so high that the material forming the predetermined portion undergoes modifications in the form of a predetermined material transformation
Implementation Method 3
several modifications are successively produced in the crystal lattice by the laser exposure, wherein the crystal lattice cracks as a result of the modifications in the regions surrounding the modifications
Implementation Method 4
the cracks in the region of the modifications predetermine the detachment region or several partial detachment regions
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present invention relates to a method for generating a detachable area (2) in a solid (1) for detaching a solid component (12), in particular a solid layer (12), from the solid (1), wherein the solid component (12) to be detached is thinner than the solid after the solid component (12) has been reduced. According to the invention, the method comprises at least the following steps: providing a solid (1) to be processed, wherein the solid (1) preferably consists of a chemical compound; providing a laser light source;The laser beams penetrate the solid (1) via a surface (5) of the solid portion (12) to be separated, the laser beams defining a predetermined portion of the solid (1) within the solid (1) to form a detachment area (2) or several partial detachment areas (25, 27, 28, 29), characterized in that the laser beams successively generate several modifications (9) in the crystal lattice, the crystal lattice cracking in at least a portion of the regions surrounding the modifications (9) as a result of the modifications (9), the detachment area (2) or several partial detachment areas (25, 27, 28, 29) being defined by the cracks in the region of the modifications (9).