Laser Soldering of LED Chips With Adjustable Beam Coverage
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Solution Overview
Problem
Conventional methods for fixing LED chips on circuit substrates require removing the substrate, which is inefficient and may damage the components, and existing soldering techniques do not effectively address the need for precise and reliable attachment of LED chips for high-color performance displays.
Innovation Solution
A method using a laser heating device that applies an energy beam with varying coverage to melt conductors and securely attach LED chips to the substrate, allowing for precise placement and detachment, utilizing a laser source with an optical module to adjust beam size and intensity for efficient soldering and rework.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional substrate removal method is used to fix LED chips, then LED chips can be attached to circuit substrate, but the process is inefficient and may damage components
Solution Approach 1:
The patent replaces the conventional mechanical substrate removal method with a laser-based energy beam system. The laser beam melts the conductor material to achieve soldering, eliminating the need for mechanical substrate removal and reducing the risk of component damage while improving soldering efficiency.
Solution Approach 2:
The patent utilizes controlled changes in energy beam parameters (intensity, duration, focal point) to precisely control the melting of conductor material. By adjusting these parameters, the system achieves reliable soldering without damaging surrounding components, resolving the contradiction between efficiency and safety.
2Manufacturing precision
If energy beam with first coverage is applied for soldering, then precise soldering can be achieved, but the coverage area is limited
Solution Approach 1:
The patent employs a movable platform that can dynamically adjust the position of the circuit substrate relative to the energy beam source. This dynamic positioning system allows the focused energy beam to precisely target different soldering locations while the platform moves the substrate into position, maintaining both precision and expanded operational coverage.
Solution Approach 2:
The patent introduces spatial movement in another dimension by using a movable platform to reposition the substrate. This allows the fixed energy beam to cover a larger effective area by sequentially treating different locations, thus expanding the coverage area while maintaining precise soldering capability at each point.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and efficient soldering of LED chips onto circuit substrates, ensuring strong electrical connections while allowing for easy rework and repositioning, thereby improving the manufacturing process for LED displays with enhanced color performance.
Implementation Method 1
providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage
Implementation Method 2
melting the conductor within the second coverage via the energy beam
Data Source
AI summary
A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.