Laser Lens Positioning for Adaptive Solder Pad Heating
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Solution Overview
Problem
Conventional laser soldering devices face inefficiencies due to the inability to adjust the laser spot size without moving the entire device, leading to potential overheating or underheating of solder pads and reduced production efficiency.
Innovation Solution
A laser processing device equipped with a lens module comprising a first and second lens, a driving module that allows the first lens to move relative to the second lens, and a camera module that captures images of the workpiece to automatically adjust the laser spot size, enabling precise focusing without relocating the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the laser spot size is increased to heat larger solder pads, then the heating coverage is improved, but the printed circuit board may be burned or damaged by excessive heat
Solution Approach 1:
The patent applies the dynamics principle by making the lens movable along the optical axis through a driving module. This allows the laser spot size to be dynamically adjusted by changing the distance between the lens and the workpiece, enabling the system to adapt to different solder pad sizes while maintaining appropriate heat concentration and avoiding PCB damage.
2Object-affected harmful factors
If the laser spot size is decreased to avoid overheating, then the heat damage is reduced, but the solder pads may not be evenly heated
Solution Approach 1:
The driving module enables dynamic adjustment of the lens position, which directly controls the laser spot size. This dynamic capability allows the system to optimize the laser spot size for each specific solder pad, ensuring even heat distribution across the entire pad surface while preventing heat concentration that could damage the PCB.
Solution Approach 2:
The camera module captures images of the solder pad and transmits them to the processing unit, which then controls the driving module to adjust the lens position. This feedback loop ensures that the laser spot size is precisely adjusted to match the actual solder pad size, achieving both even heating and prevention of overheating.
3Manufacturing precision
If the whole laser processing device is moved to adjust the laser spot size, then the focusing accuracy is improved, but the production efficiency is reduced
Solution Approach 1:
The patent segments the device into a stationary laser processing device and a movable lens component. By isolating only the lens as the movable part while keeping the main device stationary, the system achieves focusing adjustment capability without requiring movement of the entire device, thus maintaining high production efficiency while ensuring accurate focusing.
Solution Approach 2:
The driving module provides dynamic positioning of the lens along the optical axis, enabling quick and precise adjustment of the laser spot size. This dynamic lens positioning system allows for rapid focusing adjustments between different solder pads, significantly improving production efficiency compared to moving the entire device.
4Device complexity
If a fixed lens is used in the laser processing device, then the device structure is simplified, but the adaptability to different solder pad sizes is reduced
Solution Approach 1:
The patent transforms the fixed lens structure into a dynamic one by adding the driving module that can move the lens along the optical axis. This relatively simple structural addition provides significant functional improvement, enabling the device to adapt to various solder pad sizes while maintaining ease of operation and reasonable device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances production efficiency by allowing for flexible and precise adjustment of the laser spot size, reducing human error and improving the even heating of solder pads, thus preventing damage to printed circuit boards.
Implementation Method 1
a lens module with several optical lenses is provided for guiding and focusing the laser light in the desired area
Implementation Method 2
the laser beam E is then focused on the solder pad S (as the laser beam E′ shown in FIG. 1)
Implementation Method 3
external light is reflected by the workpiece and propagates through the splitter to the camera module
Implementation Method 4
The camera module captures an image of the workpiece
Implementation Method 5
the laser emitter emits a laser beam E through the lens 11
Implementation Method 6
the solder pads may not be evenly heated
Data Source
AI summary
A laser processing device for processing a workpiece is provided, including a laser emitter, a lens module, a driving module, a camera module, and a processing unit. The lens module has a first lens and a second lens, wherein the laser emitter emits a laser beam through the first and second lenses to the workpiece. The driving module drives the first lens to move relative to the second lens. The camera module captures an image of the workpiece. The processing unit is electrically connected to the camera module and the driving module, wherein the camera module transmits an image signal to the processing unit according to the image of the workpiece, and the processing unit transmits a driving signal to the driving module according to the image signal, driving the first lens to move relative to the second lens. A method for processing a workpiece is also provided.