Semiconductor Laser Lens Layout for Thin Heat-Dissipating Emitters
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting devices are thick, which can hinder heat dissipation and make them less efficient.
Innovation Solution
The light emitting device is designed with a thinner submount and a specially shaped lens that extends beyond a reference plane, allowing for a gap between the lens and the base member, thereby reducing the overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional light emitting device structure is used, then the device is structurally stable, but the thickness is large which hinders heat dissipation
Solution Approach 1:
The lens is designed with an asymmetric structure where the distance from the lower surface to the reference plane (H1) is different from the distance from the reference plane to the upper surface (H2). Specifically, H1 is set to 0.05 to 0.15 times the outer diameter D, while H2 is set to 0.2 to 0.4 times D, creating an optimized asymmetric configuration that reduces thickness while maintaining heat dissipation performance
Solution Approach 2:
The patent optimizes specific dimensional parameters of the lens including the distance H1 from the lower surface to the reference plane, the distance H2 from the reference plane to the upper surface, and the outer diameter D. By carefully controlling these parameters within specific ranges, the device achieves reduced thickness while maintaining effective heat dissipation
2Length of stationary object
If the lens is positioned closer to the base member to reduce thickness, then the overall device thickness decreases, but the lens may contact the base member causing structural issues
Solution Approach 1:
A reference plane is introduced as an intermediary conceptual tool to define and control the position of the lens relative to the base member. The distance H1 from the lower surface to the reference plane serves as a controlled intermediary parameter that ensures the lens maintains an appropriate gap from the base member, preventing contact while achieving minimal thickness
Solution Approach 2:
By optimizing the parameter H1 (distance from lower surface to reference plane) within the range of 0.05 to 0.15 times the outer diameter D, the patent ensures the lens is positioned at an optimal distance from the base member, maintaining structural stability while minimizing overall device thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation and reduces the thickness of the light emitting device, enhancing its efficiency and manufacturing feasibility.
Implementation Method 1
The lens includes a lens portion having a cylindrical surface, an incident surface, and a lower surface. The incident surface faces the emission end surface of the semiconductor laser element so that the light is to be incident on the incident surface.
Data Source
AI summary
A light emitting device includes a base member, a submount, a semiconductor laser element, and a lens. The lens includes a lens portion having an incident surface and a lower surface. When a plane parallel to the lower surface of the lens portion and including a generatrix farthest from the emission end surface is defined as a reference plane, portions of the lens portion, each of which is within a range of a predetermined distance, are symmetrical with respect to the reference plane in a direction normal to the reference plane. A portion of the lens portion extends beyond the predetermined distance from the reference plane in a direction opposite to the lower surface. The lower surface of the lens portion is located at the predetermined distance from the plane. A gap is present between the lower surface of the lens portion and the upper surface of the base member.