Laser Device Lid and Side Wall Integration for Assembly
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Solution Overview
Problem
Semiconductor laser modules face challenges in assembly and manufacturing due to the need for precise electrical connection and optical alignment of semiconductor laser elements with components on the side wall of the housing, leading to increased costs and complexity.
Innovation Solution
A laser device design featuring a base plate with semiconductor laser elements, a lid portion integrally formed with side walls, and a top plate that covers the sides, allowing for simplified assembly and reduced manufacturing costs by eliminating the need for complex alignment and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If semiconductor laser elements are housed in a housing with side wall components for electrical connection and optical alignment, then functional integration is achieved, but assembly complexity and manufacturing cost increase
Solution Approach 1:
The housing is divided into a base plate portion and a lid portion that can be separately manufactured and then assembled together. The semiconductor laser element is mounted on the base plate portion, while the output unit and terminal unit are provided on the lid portion, enabling modular assembly and simplifying the manufacturing process.
Solution Approach 2:
A submount is introduced as an intermediary component between the semiconductor laser element and the base plate portion. The submount facilitates electrical connection and positioning, serving as a mediator that simplifies the overall assembly process and reduces direct complexity between the laser element and housing structures.
2Reliability
If precise electrical connection and optical alignment are required between semiconductor laser elements and side wall components, then functional performance is improved, but assembly difficulty increases
Solution Approach 1:
The terminal unit is preliminarily positioned on the lid portion before final assembly, with its electrode预先 arranged to facilitate subsequent electrical connection with the semiconductor laser element. This preliminary arrangement of components simplifies the final assembly process while ensuring reliable electrical connection.
Solution Approach 2:
The submount acts as a mediator that pre-provides electrical connection paths and positioning features. By incorporating electrode structures on the submount beforehand, the need for complex real-time alignment during assembly is reduced, improving both reliability and assembly ease.
3Volume of moving object
If multiple components are integrated in a single housing, then device compactness is achieved, but manufacturing cost increases
Solution Approach 1:
The housing is segmented into modular components (base plate portion and lid portion) that can be manufactured separately using cost-effective processes and then assembled. This segmentation allows for simplified manufacturing of individual parts while maintaining compact overall device volume when assembled together.
Solution Approach 2:
The lid portion serves multiple functions: it covers the housing, provides mounting structures for the output unit and terminal unit, and facilitates optical alignment. This multi-functionality reduces the need for separate components, lowering manufacturing cost while maintaining device compactness.
Data Source
AI summary
A laser device that is easily assembled and can be manufactured at low cost and a light-source device using the same are provided. The laser device includes a base plate portion, a semiconductor laser element placed on the base plate portion, a lid portion provided on the base plate portion, on which the semiconductor laser element is placed, and including a top plate, and a side wall portion covering a part or all of lateral sides of a space between the base plate portion and the top plate. The top plate is integrally formed with a part or all of the side wall portion.