Laser Light-Emitting Apparatus Sealing and Thermal Management
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Solution Overview
Problem
Conventional laser light-emitting apparatuses face reliability issues when used in tough environments due to exposure of the laser chip and inefficient heat dissipation, and they lack high workability and favorable optical characteristics for emitting various color lights, including white light, for applications like vehicle headlights.
Innovation Solution
A laser light-emitting apparatus with a sealed laser chip and wavelength converting board, where the wavelength converting board is inserted between two base boards to efficiently receive the laser beam at a right angle, allowing for efficient heat dissipation and emission of high uniform color tone and intensity lights, and eliminating the need for complex wire bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the laser chip is exposed from the cavity to simplify the structure, then the device complexity is reduced, but the reliability deteriorates under tough environments
Solution Approach 1:
The patent applies sealing structures including lids and encapsulation materials that cover and protect the laser chip, transforming it from an exposed state to a sealed state. This resolves the contradiction by maintaining structural simplicity while improving reliability through protective encapsulation that shields the laser chip from harsh environmental conditions.
2Reliability
If the laser chip is sealed to improve reliability, then the reliability improves under tough environments, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces thermal conductive materials as intermediaries between the laser chip and the heat sink. These materials facilitate efficient heat transfer from the sealed laser chip to the external heat dissipation structure, resolving the contradiction by enabling both sealing for reliability and effective heat dissipation through the intermediary thermal conductive path.
Solution Approach 2:
The patent segments the heat dissipation path into multiple stages: heat generation at the laser chip, heat conduction through thermal conductive materials to the heat sink, and heat radiation from the heat sink surface. This segmentation allows the laser chip to remain sealed while heat is efficiently removed through dedicated thermal management structures.
3Ease of manufacture
If conventional wiring methods are used to connect electrodes, then the electrical connection is achieved, but the manufacturing complexity increases due to wire bonding processes
Solution Approach 1:
The patent merges the electrical connection function with the structural substrate by forming conductive patterns directly on the substrate surface. This eliminates the need for separate wire bonding processes, resolving the contradiction by simplifying manufacturing while achieving reliable electrical connections between electrodes and external terminals.
Solution Approach 2:
The patent replaces mechanical wire bonding with a planar conductive pattern system where electrical connections are established through printed or deposited conductive traces on the substrate. This substitution eliminates complex mechanical wire bonding operations, improving ease of manufacture and reducing manufacturing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable semiconductor light-emitting apparatuses with favorable optical characteristics and high workability, capable of emitting high uniform color tone and intensity lights from a small opening, suitable for vehicle headlight applications under tough environments, with improved reliability and simplified manufacturing.
Implementation Method 1
a wavelength converting board (15), inserted into an inserting concave portion (19R) of the first base board (11)
Implementation Method 2
a heat sink (61) attaching the first sub mount (66) along with the laser chip (67) via a second solder (62)
Data Source
AI summary
The disclosed subject matter relates to a reliable laser light-emitting apparatus. The laser light-emitting apparatus can include a laser chip, which is sealed by a first base board having an opening, a second base board and a wavelength converting board. The wavelength converting board can be attached between the first base board and the second base board so as to be located between the opening and the laser chip. A laser beam emitted from the laser chip can be emitted from the opening via the wavelength converting board, and heats generated from the laser chip and the wavelength converting board can efficiently radiate from the first base board and the first base board. Thus, the disclosed subject matter can provide reliable semiconductor light-emitting apparatuses, which can emit various color lights having favorable optical characteristics and which can be used for lighting units such as a headlight under the tough environments.