Light Guide Structure for Laser Wavelength Conversion Cooling
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Solution Overview
Problem
Conventional edge-emitting laser diode devices suffer from inferior heat dissipation, which is crucial for maintaining their performance and longevity.
Innovation Solution
A laser device comprising a substrate, a laser element, a light guide member that is both light-transmissible and thermally conductive, and a wavelength conversion layer, where the light guide member reflects and redirects the laser light while facilitating heat transfer from the wavelength conversion layer to the substrate through its thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional edge-emitting laser diode devices are packaged in transistor outline packages, then the device structure is compact and easy to manufacture, but heat dissipation performance deteriorates
Solution Approach 1:
The patent merges the light guiding function and heat dissipation function into a single component by integrating the light guide member with the substrate. The light guide member is directly coupled to the substrate, creating a unified structure that simultaneously guides light and dissipates heat, eliminating the need for separate packaging components while improving thermal management.
Solution Approach 2:
The light guide member serves multiple functions: it guides and redirects the laser beam through its reflection surfaces, and simultaneously acts as a heat dissipation pathway by being thermally coupled to the substrate. This multi-functional design resolves the contradiction by making the same component responsible for both optical performance and thermal management.
2Illumination intensity
If the light guide member is positioned to redirect laser light, then the viewing angle is reduced and light intensity is improved, but the structural complexity increases
Solution Approach 1:
The patent combines the light guiding function and heat dissipation function into a single component by integrating the light guide member with the substrate. The light guide member is directly coupled to the substrate, creating a unified structure that simultaneously guides light and dissipates heat, eliminating the need for separate packaging components while improving thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation and allows for a smaller viewing angle, making it suitable for applications like automotive lighting, while maintaining high light intensity and efficiency.
Implementation Method 1
has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray
Implementation Method 2
The wavelength conversion layer is adapted to convert wavelength of the laser light ray from the light guide member to result in a laser beam
Implementation Method 3
The wavelength conversion layer contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member
Data Source
AI summary
The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.