Laser Light Source Device Power Feed Path Design
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Solution Overview
Problem
In laser light source devices, the nickel-gold plated layer on the heat sink acts as a power feed path, leading to high wiring resistance and increased temperature of the semiconductor laser array, which reduces laser output and reliability, while also being susceptible to electrolytic corrosion from cooling water.
Innovation Solution
A laser light source device configuration featuring a plate-like heat sink with a sub-mount substrate and insulation plate, using metal wires to connect electrode plates to the semiconductor laser array, minimizing power feed path area and separating it from the cooling water flow channel to prevent corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a nickel-gold plated layer is formed on the entire surface of the heat sink to serve as the power feed path, then electrical connection is established, but the plated layer generates heat due to large wiring resistance when carrying large currents
Solution Approach 1:
The power feed path function is extracted from the heat sink's plated layer and transferred to a separate sub-mount substrate with dedicated power feed paths. This separates the electrical conduction function from the heat dissipation function, allowing the heat sink to focus on cooling while the sub-mount substrate handles high-current power delivery with lower resistance.
Solution Approach 2:
A sub-mount substrate is introduced as an intermediary component between the heat sink and the semiconductor laser array. This sub-mount substrate serves as a dedicated power distribution platform that reduces wiring resistance and heat generation in the power feed path, while still allowing thermal coupling to the heat sink for cooling.
2Reliability
If a nickel-gold plated layer is used as the power feed path on the heat sink, then electrical connection is provided, but electrolytic corrosion occurs in the flow channel due to contact with cooling water
Solution Approach 1:
The power feed path is extracted from the heat sink structure and placed on a separate sub-mount substrate. This physical separation removes the plated layer from direct contact with cooling water, eliminating the source of electrolytic corrosion while maintaining electrical connectivity through the sub-mount substrate.
Solution Approach 2:
The sub-mount substrate acts as an intermediary that provides the power feed path function without being in direct contact with the cooling water environment. This intermediary structure protects the plated layer from corrosive conditions while still enabling electrical connection to the semiconductor laser array.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces overheating of the semiconductor laser array, prevents electrolytic corrosion, and enhances the long-term reliability of the device by minimizing heat generation due to wiring resistance and isolating the power feed path from the cooling water.
Implementation Method 1
a material for the heat sink needs to have excellent thermal conductivity in order to dissipate heat of the semiconductor laser array
Implementation Method 2
a flow channel for cooling water is included
Implementation Method 3
metal wires configured to electrically connect respectively between the first electrode plate and the sub-mount substrate, and between the second electrode plate and the semiconductor laser array
Implementation Method 4
an insulation plate configured to be placed in a region other than the sub-mount substrate on the heat sink and produced of a material with electrical insulation properties
Data Source
AI summary
Provided is a laser light source device which has a plurality of semiconductor laser elements arranged in an array and is provided with: a heat sink; a sub-mount substrate which is placed on one end edge of the heat sink, which has a power feed path, and on which the semiconductor laser array is mounted; an insulation plate placed in an area other than the sub-mount substrate on the heat sink; a first electrode plate mounted on the insulation plate; a second electrode plate mounted on the insulation plate separately from the first electrode plate; metal wires electrically connecting respectively between the first electrode plate and the sub-mount substrate and between the second electrode plate and the semiconductor laser array; and a cooling block on which the heat sink is mounted and which has a cooling water flow channel inside of the cooling block.