Laser Lithography Device In-Situ Deviation Correction
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Solution Overview
Problem
Current laser lithography methods for producing three-dimensional structures are time-consuming and difficult to automate, requiring iterative calibration processes to achieve high precision, which limits their efficiency and flexibility.
Innovation Solution
A method using a laser lithography device that sequentially defines structural regions (voxels) within a lithography material by controlling the exposure dose through multi-photon absorption, allowing for precise structuring and in-situ correction of deviations from the target structure using exposure data sets and analysis data sets, enabling direct correction and optimization without the need for extensive development or preparation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If iterative calibration processes are used to achieve high precision in laser lithography, then manufacturing precision is improved, but productivity deteriorates due to time-consuming repeated measurements and adjustments
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing correction values in a lookup table based on anticipated deviations (e.g., focus position errors, astigmatism) before actual production. This allows the system to immediately compensate for expected errors without performing time-consuming iterative measurements during manufacturing, thus maintaining high precision while improving productivity.
Solution Approach 2:
The patent uses copying by creating a digital model of the expected deviations and their corrections (lookup table) that can be rapidly applied during production. Instead of physically measuring and adjusting for each defect, the system copies pre-computed correction data and applies it automatically, significantly reducing measurement and adjustment time while maintaining correction effectiveness.
2Manufacturing precision
If iterative calibration processes are implemented to optimize exposure dose, then manufacturing precision is improved, but loss of time increases due to repeated development and measurement cycles
Solution Approach 1:
The patent performs preliminary calculations to determine correction values for various anticipated deviations and stores them in advance in a lookup table. This eliminates the need for time-consuming iterative development and measurement cycles during actual production, as corrections can be immediately applied based on measured parameters like focus position or astigmatism magnitude.
Solution Approach 2:
The patent implements feedback by measuring actual deviation parameters (such as focus position error or astigmatism) and using these measurements to automatically select and apply the appropriate pre-calculated correction values from the lookup table. This closed-loop approach ensures high precision without requiring multiple iterative cycles, significantly reducing calibration time.
3Manufacturing precision
If complex calibration procedures are used to achieve precise structuring, then manufacturing precision is improved, but device complexity increases due to multiple measurement and adjustment steps
Solution Approach 1:
The patent simplifies the system by copying pre-computed correction strategies into a lookup table that maps measured deviation parameters to appropriate correction values. This eliminates the need for complex real-time calculation algorithms and multiple adjustment mechanisms, reducing device complexity while maintaining the ability to achieve high precision through automatic correction.
Solution Approach 2:
The patent enables self-service by allowing the lithography system to automatically measure deviation parameters (such as focus position or astigmatism) and autonomously select and apply the corresponding correction values from the lookup table without requiring external intervention or complex coordination between multiple adjustment mechanisms, thereby reducing operational complexity.
4Manufacturing precision
If traditional calibration methods with repeated development are used, then manufacturing precision is improved, but ease of operation deteriorates due to difficulty in automation
Solution Approach 1:
The patent makes the calibration process self-service by enabling the system to automatically measure deviation parameters (such as focus position error or astigmatism), autonomously query the lookup table for appropriate correction values, and automatically apply the selected corrections. This complete automation eliminates the need for manual intervention in repeated development and measurement cycles, significantly improving ease of operation and automatability while maintaining high precision.
Solution Approach 2:
The patent implements automated feedback control by continuously measuring actual deviation parameters during production and automatically selecting corresponding correction values from the lookup table. This closed-loop automated feedback system eliminates manual calibration steps and enables the process to be fully automated, improving ease of operation while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of high-precision three-dimensional structures with reduced time and equipment expenditure, enabling faster cycle times and automated optimization by directly correcting deviations in the structure during the writing process.
Implementation Method 1
An exposure dose is irradiated into the lithographic material in the focus area of the laser writing beam, whereby the lithographic material is locally modified by utilizing multi-photon absorption, thus creating or writing a structural region
Data Source
Figure 1
Figure 2a~2b
Figure 3
AI summary
The invention relates to a method for generating a three-dimensional target structure (42) in a lithographic material using a laser lithography device, wherein the target structure is defined by a focus area (26) of a laser writing beam passing through a scan manifold (38) in a writing area of the laser lithography device, wherein an exposure dose is emitted into the lithographic material in the focus area of the laser writing beam and a structure area (52) is locally defined, wherein at least one exposure data set, which represents a local exposure dose for the scan manifold depending on location, is determined, wherein a structure approximating the target structure is defined on the basis of the at least one exposure data set, wherein this structure is analyzed and at least one analysis data set, which represents the analyzed structure, is determined.wherein a deviation data set, representing deviations of the already defined structure from the target structure, is determined, wherein at least one correction exposure data set is determined, and wherein a correction structure is defined based on the at least one correction exposure data set. The invention also relates to a laser lithography device.