Laser Machining Thin Chips Deflection Control
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Solution Overview
Problem
In laser processing methods, thin objects with fine chip sizes often deflect during cutting, leading to unintended cuts and reduced accuracy due to deflecting forces generated during the formation of modified regions.
Innovation Solution
A laser processing method that forms a first modified region along a cutting line and a second modified region between the main faces, generating fractures that cancel out deflecting forces, allowing for precise control and accurate cutting by an autofocus unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a modified region is formed in the object by laser irradiation, then cutting can be achieved, but the object deflects due to generated deflecting force
Solution Approach 1:
The patent divides the modified region formation into two separate steps: first forming a modified region along the cutting line, then forming a second modified region between the main faces. This segmentation allows the deflecting forces to be balanced and canceled out, preventing object deflection while maintaining cutting accuracy
Solution Approach 2:
The patent applies preliminary anti-action by forming the second modified region specifically to generate counteracting forces that cancel the deflecting force produced during the first modified region formation. This preemptive measure prevents deflection before it affects cutting accuracy
2Manufacturing precision
If the object is thin with 100 μm thickness and fine chip size of 1 mm×1 mm or less, then fine chip processing is achieved, but deflection occurs remarkably
Solution Approach 1:
For thin fine chip processing, the patent segments the modified region formation into two distinct steps with different orientations. The first modified region is formed along the cutting line, and the second modified region is formed between the main faces, creating balanced forces that prevent remarkable deflection in thin objects
Solution Approach 2:
The patent changes the spatial parameters of modified region formation by creating regions at different locations and orientations. This parameter change strategy effectively controls deflection in thin fine chip processing while maintaining the required manufacturing precision
3Productivity
If a fracture extends from the first modified region to the other main face, then cutting is achieved, but the object may be fully cut against intentions
Solution Approach 1:
The patent segments the fracture formation process by first creating a fracture to the other main face for efficient cutting, then forming a second modified region to control and balance the forces. This prevents unintended full cuts while maintaining cutting efficiency
Solution Approach 2:
The patent applies preliminary anti-action by forming the second modified region to generate counteracting forces that prevent unintended full cuts. This measure is taken after the first fracture is formed but before complete separation occurs, ensuring reliability while maintaining productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively inhibits object deflection, enhances cutting accuracy, and prevents unintended full cuts, especially in thin fine chip processing, by releasing and canceling out deflecting forces through strategically formed fractures.
Implementation Method 1
irradiating a sheet-like object to be processed with laser light while locating a converging point within the object so as to form a modified region
Implementation Method 2
irradiates a sheet-like object to be processed with laser light... so as to form a modified region in the object
Implementation Method 3
generate a fracture extending from the second modified region to the one main face
Data Source
AI summary
An object to be processed 1 is irradiated with laser light L along a line to cut 5a while locating a converging point within the object 1, so as to form a modified region 7a. Thereafter, the irradiation with the laser light L is performed again along the line 5a, so as to form a modified region 7b between a front face 3 and the first modified region 7a in the object 1 and generate a fracture Cb extending from the modified region 7b to the front face 3. Therefore, a deflecting force F1 occurring when forming the modified region 7a in the object 1 can be released and canceled out by the fracture Cb. As a result, the object 1 can be inhibited from deflecting.