Laser Machining Apparatus Multi-Beam Splitting
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Solution Overview
Problem
Conventional laser machining apparatuses are limited by dividing a single laser beam into only two beams, restricting Unit Per Hour (UPH) and making them unreliable due to the inability to selectively use laser beams if any component of the beam transmitting means fails.
Innovation Solution
A laser machining apparatus that divides a single laser beam into four beams using shuttle units with beam dividing and penetrating units, allowing for selective path adjustment and use of multiple pairs of scanners and a single scan lens to irradiate the substrate, enabling flexible processing and maintaining operation even if components fail.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single laser beam is divided into two laser beams using a beam splitter, then the laser beam can be transmitted along different paths, but the Unit Per Hour (UPH) is limited and the system reliability is reduced
Solution Approach 1:
The patent divides a single laser beam into four separate laser beams using three beam splitters arranged in sequence. The first beam splitter divides the laser beam into two paths, the second beam splitter divides one path into two more paths, and the third beam splitter divides the other path into two more paths, creating a total of four independent laser beam paths that can be independently controlled and used for machining operations
Solution Approach 2:
The patent introduces a shutter unit with movable shutters that can dynamically block or transmit each of the four laser beam paths independently. This allows the system to flexibly adjust the number of active laser beams from one to four based on processing requirements, and to maintain operation with reduced beams if any component fails, thereby improving both productivity and reliability
2Adaptability or versatility
If a single laser beam is always divided into two laser beams, then the laser beam transmission paths are established, but the system cannot adapt to component failures and loses operational flexibility
Solution Approach 1:
The shutter unit with independently controllable shutters enables dynamic reconfiguration of the laser beam transmission paths. Each shutter can be independently opened or closed to activate or deactivate specific laser beam paths, allowing the system to adapt to component failures by rerouting laser beams through alternative paths and maintaining continuous operation
Solution Approach 2:
The patent creates a multi-functional laser beam transmission system where a single laser oscillator can generate up to four independent laser beams that can be independently directed to different processing locations. The shutter unit provides universal control over all four paths, enabling the system to perform various machining operations with different numbers of laser beams depending on the specific processing requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances processing efficiency by maximizing UPH, reduces manufacturing costs, and improves production stability by allowing continued operation despite component failures.
Implementation Method 1
a beam splitter on which the laser beam emitted from the laser oscillator is incident to be divided into two laser beams, that is, to be transmitted along a first path and a second path
Implementation Method 2
a scan lens on which the four laser beams are incident to be collected on a spot having a predetermined diameter and irradiated onto the substrate
Data Source
AI summary
Provided is a laser machining apparatus. The laser machining apparatus includes: a laser oscillator emitting laser beams; a first dividing means on which the laser beams emitted from the laser oscillator are incident to be selectively divided so that the incident laser beams progress along at least one path from among a pair of first paths; a second dividing means on which the laser beams that passed through any one of the first paths are incident to be selectively divided so that the incident laser beams progress along at least one path from among a pair of second paths; a third dividing means on which the laser beams that passed through the other one of the first paths are incident to be selectively divided so that the incident laser beams progress along at least one path from among a pair of third paths; four pairs of scanners on which the laser beams that passed through the first, second, and third dividing means are incident to each be deflected onto desired positions on a substrate so as to be processed; and a scan lens on which the laser beams that passed through the four pairs of scanners are incident to be collected on a spot having a predetermined diameter and irradiated onto the substrate.