Laser Machining Heat Dissipation Control
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Solution Overview
Problem
Existing laser machining methods face issues with variations in hole diameter due to cumulative heating effects when the shortest machining route is set, leading to reduced machining quality.
Innovation Solution
A laser machining method that involves scanning a laser beam across a printed circuit board in the X and Y directions, dividing the board into scan areas, sorting the order of drilling within each area for the shortest route, swapping adjacent holes if they are close, and pausing for a heat dissipation time if the distance between them is below a threshold to minimize heating effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the shortest machining route is set by applying nearest neighbor algorithm and 2-opt algorithm, then machining speed is improved, but cumulative heating effects occur causing hole diameter variations and reduced machining quality
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing heat influence data for each hole position before machining. The control device determines in advance which holes are likely to be affected by heating from adjacent holes, and pre-establishes a machining sequence that avoids machining heat-sensitive holes immediately after their heat-influenced neighbors, thus preventing cumulative heating effects while maintaining efficient routing
Solution Approach 2:
The patent changes the machining sequence parameter dynamically based on heat influence analysis. Instead of using a fixed shortest route, the system adjusts the machining order by skipping certain holes or inserting pause periods when heat accumulation is predicted, thereby changing the temporal parameter of hole processing to eliminate thermal interference while preserving overall machining efficiency
2Manufacturing precision
If every other position is skipped to avoid heating effects, then hole diameter consistency is improved, but machining route length increases and machining efficiency decreases
Solution Approach 1:
The patent implements feedback by continuously analyzing the spatial relationship between consecutive holes in the machining sequence and the thermal influence radius of previously machined holes. The control device uses this feedback to dynamically adjust the machining sequence, skipping holes only when necessary to avoid heat accumulation, rather than applying a fixed skip pattern. This feedback-based approach minimizes unnecessary skips while ensuring hole diameter consistency
Solution Approach 2:
The system changes the machining sequence parameter adaptively based on real-time heat influence assessment. Rather than uniformly skipping every other hole, the control device modifies the sequence locally only where heat accumulation would occur, maintaining the shortest possible overall route while preventing thermal interference at critical positions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes variations in hole diameter and improves machining quality by addressing heating effects while maintaining the shortest machining route.
Implementation Method 1
a laser beam source (1) for emitting a laser beam (2)
Implementation Method 2
a first galvanometer mirror (3a) for scanning the laser beam (2) in an X direction and a second galvanometer mirror (3b) for scanning the laser beam (2) in a Y direction
Data Source
AI summary
Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1≦N≦“the maximum number of holes to be drilled in the area”−1″) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3). The scanning area is machined and then machining each scanning area, specifically in machining the (N+1)th hole, after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value. Subsequently, machining is performed (S4).