Laser Machining Device for Solar Cell Thin-Film Patterning
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Solution Overview
Problem
Conventional laser machining for solar cells is inefficient due to long machining times and high costs, with unstable beam quality and limited productivity improvement, as the process requires multiple beam splitting and reciprocating workpiece movement, which hinders the reduction of solar cell production costs.
Innovation Solution
A laser machining device with a constant-speed feeder and multiple beam heads that scan a single laser beam across the workpiece in a direction perpendicular to the feeding direction, allowing for continuous and efficient machining line formation by alternating or concurrently using beam heads, and incorporating a controller to synchronize the scanning speed with the feeding speed, reducing takt time and improving production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple beam splitting is used to form machining lines, then machining efficiency is improved, but beam quality becomes unstable and device complexity increases
Solution Approach 1:
The patent divides the single laser beam into multiple beams using beam splitting, allowing simultaneous machining of multiple lines. This segmentation enables parallel processing of multiple thin-film layers, significantly improving machining efficiency while maintaining beam quality through controlled optical path management
Solution Approach 2:
The patent introduces beam combining optics as an intermediary to recombine multiple split beams back into a single stable beam path. This intermediary component ensures that the beam quality remains stable while still achieving the productivity benefits of multi-line machining through the temporary separation and recombination process
2Manufacturing precision
If reciprocating workpiece movement is used for machining, then complete coverage is achieved, but machining time increases and productivity decreases
Solution Approach 1:
Instead of moving the workpiece back and forth in reciprocating motion, the patent inverts the approach by moving the laser beam in the opposite direction across stationary or continuously advancing workpiece. This inversion eliminates idle return movements and maintains continuous machining action, thereby improving productivity while ensuring complete coverage
Solution Approach 2:
The patent ensures continuous useful action by maintaining the laser beam in a constant forward scanning motion without reciprocating idle movements. The beam continuously processes new portions of the workpiece, eliminating wasted time during direction changes and maintaining uninterrupted machining throughput
3Productivity
If multiple laser oscillators are installed to improve machining speed, then productivity increases, but device complexity and cost increase
Solution Approach 1:
The patent merges the functions of multiple laser oscillators into a single oscillator by using beam splitting to create multiple beams from one source. This combining approach achieves the same multi-line machining capability as multiple oscillators would provide, but with reduced device complexity, lower cost, and simplified maintenance while maintaining high productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables continuous and efficient formation of machining lines, significantly reducing the takt time of solar cell production, improving productivity, and maintaining stable machining quality while minimizing the need for multiple laser oscillators, thus lowering production costs.
Implementation Method 1
irradiating the transparent electrode layer 111 with a laser beam 115 emitted from a laser machining device, thereby removing part of the transparent electrode layer 111 to form straight machining lines 112A
Data Source
AI summary
A beam head unit including beam heads configured to scan a single laser beam on a thin-film layer of a workpiece from an irradiation start side toward an irradiation end side in a direction crossing a feeding direction of the workpiece while the workpiece is fed by a constant-speed feeder; laser oscillator configured to emit the laser beam to irradiate each beam head; a controller configured to control scanning speed of the laser beam emitted from each beam head and feeding speed of the workpiece to control a machining line formed in the workpiece fed at the predetermined feeding speed. The controller is configured to switch a beam head to use to form the machining line between the beam heads to form the machining line alternately. This configuration makes it possible to form machining lines highly efficiently in the thin-film layer of the workpiece while feeding the workpiece.