Laser Machining of Hard Microtechnology Workpieces With XYZ Positioning
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Solution Overview
Problem
Traditional machining techniques for hard materials like diamond, sapphire, and ceramics are inefficient and prone to variations in precision, especially when producing small parts with complex shapes like rounded holes in watchmaking.
Innovation Solution
A method and system utilizing a femtosecond laser for machining small parts made of hard materials, enabling fast and precise machining of concave or convex surfaces and holes by positioning the laser accurately relative to the parts using a precise XYZ position measuring system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional abrasive machining techniques are used on hard materials, then the machining process can be performed with simple equipment, but the productivity is low and manufacturing precision is poor
Solution Approach 1:
The patent replaces traditional mechanical abrasive machining with laser beam machining. The laser beam acts as a non-contact tool that ablates material through photothermal and photomechanical effects, eliminating the need for physical contact between tool and workpiece. This substitution enables high-speed machining of hard materials like sapphire while achieving precise geometric shapes such as rounded holes that are difficult to obtain with abrasive methods
Solution Approach 2:
The patent utilizes ultra-short pulse laser parameters (femtosecond to picosecond duration) with specific wavelengths and pulse energies to achieve precise material removal. By controlling laser parameters such as pulse width, repetition rate, and focal spot size, the system achieves both high productivity and manufacturing precision on hard materials without the limitations of traditional mechanical machining
2Manufacturing precision
If manual abrasive machining is used for small parts, then the equipment complexity is low, but the loss of time is high and manufacturing precision varies
Solution Approach 1:
The patent replaces manual mechanical machining with automated laser machining guided by computer control systems. The laser beam is precisely positioned using galvanometric scanners or robotic systems, eliminating manual operation variability. This automation ensures consistent machining precision across all parts while dramatically reducing total machining time through high-speed laser processing
Solution Approach 2:
The patent implements continuous laser machining operations where the laser beam continuously processes multiple parts without interruption. The system maintains optimal laser parameters throughout the machining process, ensuring consistent material removal rates and geometric precision. Multiple parts can be machined in sequence or parallel, eliminating the start-stop nature of manual machining and reducing total production time
3Productivity
If femtosecond laser machining is used for hard materials, then the manufacturing precision and productivity are high, but the device complexity and cost increase
Solution Approach 1:
The patent designs the laser machining system to handle multiple types of hard materials (sapphire, diamond, ceramics, glass) and various geometric features (holes, contours, surfaces) using a single integrated platform. The system incorporates automated part loading, multi-axis laser positioning, and adaptive process control that can be programmed for different part geometries and material types, reducing the need for multiple specialized machines and justifying the investment through high productivity and precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for the efficient machining of thousands of parts in a short time, achieving high precision and consistency, particularly suitable for watchmaking and medical applications.
Implementation Method 1
The use of very short pulse lasers, and in particular femtosecond lasers, has made it possible to machine hard materials in a new way
Data Source
Figure 1a
Figure 1b
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AI summary
The present invention relates to an apparatus (1000) for machining hard microtechnology workpieces (1). The apparatus comprises a system (220) for loading/unloading support members (100) for hard workpieces (1) and at least one laser system for machining the hard workpieces (1) and a system for controlling the laser (204). Each support member (100) comprises, at least on one side, a surface arranged so that a plurality of hard workpieces (1) can be attached thereto. The apparatus (1000) comprises a device for measuring the X-Y-Z position of each hard workpiece (1) of at least one set of hard workpieces (1) relative to a reference mark and means for recording the X-Y-Z positions, which means are arranged to engage with the laser control system (204). The laser control system comprises a system for positioning the laser (204), which system is arranged to move and position the laser relative to the hard workpiece (1), according to the recorded X-Y-Z position of the hard workpiece (1), such that the hard workpiece (1) can be machined. The invention also relates to a method for machining hard microtechnology workpieces, comprising the different steps (A-F) of: A: providing the machining apparatus (1000) according to the invention and providing a plurality of hard microtechnology workpieces (1); B: providing at least one workpiece support member (100) and attaching the plurality of hard workpieces (1) to the workpiece support member (100); C: inserting at least one of the workpiece support members (100) into a machining unit (200); D: measuring, using the measuring means, the X-Y-Z position, relative to the reference mark, of each of the hard workpieces (1) of at least one set of hard workpieces (1) attached to the workpiece support member (100), and recording the X-Y-Z positions measured by the recording means; E: performing pre-programmed steps of machining the hard workpieces (1) of at least the set by means of the at least one laser (204), the laser (204) being, before each hard workpiece (1) of the set is machined, moved and positioned relative to the hard workpiece (1) according to the X-Y-Z position of the hard workpiece (1), which position is measured and recorded in step D; F: releasing at least one of the hard workpieces (1) from its support member (100).