Laser Marking Correction for Fracture Regions

The patent divides the marking area into multiple regions with different distortion characteristics. By segmenting the correction process into region-specific operations, it achieves high precision without requiring overly complex global correction formulas, thus resolving the contradiction between simplicity and precision.

Different correction strategies are applied to different regions of the marking area. The patent uses local quality by tailoring the correction approach to specific regional characteristics, improving overall precision while maintaining reasonable process complexity through localized rather than uniform correction.

The patent segments the marking area into regions with distinct distortion patterns, allowing the use of simpler correction models within each region. This reduces the overall complexity of operations while maintaining high precision through region-specific correction rather than requiring complex global high-density measurements.

Instead of performing exhaustive high-density measurements across the entire marking area, the patent applies partial correction actions focused on critical regions. This reduces time consumption and operational complexity while achieving sufficient correction precision for the application requirements.

The patent implements a moderate segmentation strategy that divides the marking area into regions balanced between precision requirements and operational efficiency. This avoids the time-consuming exhaustive measurement of fine-grained divisions while maintaining sufficient precision through appropriately sized regional corrections.

The patent optimizes the parameters of region division (such as region size, shape, and number) to achieve the best balance between correction precision and measurement time. By carefully selecting and adjusting these parameters, it reduces time consumption while preserving necessary correction accuracy.