Laser Marking and Drilling in Stacked Semiconductor Packages
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Solution Overview
Problem
Current methods for manufacturing stacked semiconductor packages require separate processes for marking and drilling, which increases complexity and reduces efficiency.
Innovation Solution
A method that uses a single laser facility to perform both marking and drilling on stacked semiconductor packages by controlling the focus level of the laser, allowing for sequential execution of these processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate processes are used for marking and drilling, then each process can be optimized independently, but the manufacturing complexity and processing time increase
Solution Approach 1:
The patent combines marking and drilling operations into a single laser processing step by controlling laser focus level. The laser system performs both marking (at higher focus level) and drilling (at lower focus level) on the same semiconductor package without requiring separate processing facilities, thereby reducing manufacturing complexity while maintaining precision through controlled focus adjustment.
Solution Approach 2:
The laser processing system is designed to perform multiple functions (marking and drilling) using a single facility. By adjusting the focus level of the laser, the same laser beam can create marks on the semiconductor package surface or drill through the package substrate, eliminating the need for dedicated marking and drilling equipment.
2Reliability
If separate facilities are used for marking and drilling, then each facility can be specialized, but the processing time and productivity decrease
Solution Approach 1:
The patent merges marking and drilling into one continuous laser processing operation. The laser system moves through the semiconductor package, performing marking followed immediately by drilling (or vice versa) without requiring the package to be transferred between facilities, thereby reducing cycle time and improving productivity while maintaining process stability through consistent laser parameters.
Solution Approach 2:
The laser processing is performed continuously in a single pass over the semiconductor package. The laser beam maintains continuous operation, adjusting focus level dynamically between marking and drilling modes without interruption, eliminating idle time between separate processes and maximizing manufacturing efficiency.
3Ease of operation
If multiple facilities are used for marking and drilling, then each process can be independently controlled, but the equipment cost and facility requirements increase
Solution Approach 1:
A single laser processing facility is configured to perform both marking and drilling operations through software control and focus level adjustment. The same laser beam, scanning system, and positioning mechanism are used for both processes, reducing facility complexity and equipment costs while maintaining independent control over each operation through programmable parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces processing time, and improves productivity by utilizing a single laser source for both marking and drilling, minimizing the need for multiple facilities and operations.
Implementation Method 1
marking the semiconductor package with an identification mark by scanning a laser of a laser supply apparatus onto the semiconductor package
Implementation Method 2
performing laser drilling on the mold layer of the semiconductor package to form openings
Data Source
AI summary
A method of manufacturing a stacked semiconductor package includes forming a semiconductor package, the semiconductor package having one or more semiconductor chips on an upper surface of a printed circuit board (PCB), and a mold layer covering the upper surface of the PCB, marking the semiconductor package with an identification mark by scanning a laser of a laser supply apparatus onto the semiconductor package, controlling a focus level of the laser, and performing laser drilling on the mold layer of the semiconductor package to form openings.