Laser Marking Levels for Accurate Support Rail Device Labeling
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Solution Overview
Problem
Existing methods for marking electrical devices on support rails are time-consuming and prone to inaccuracies due to size tolerances and deviations, especially on longer rails, leading to incorrect positioning and prolonged marking processes.
Innovation Solution
A method that involves specifying marking instructions with corrected positions, grouping markings into levels to minimize laser head and support rail movements, and prioritizing movements to optimize the marking process, using an image capture device to adapt to actual conditions and apply markings efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If markings are applied to each electrical device on long support rails using conventional methods, then all devices can be marked, but the marking process becomes time-consuming and positioning becomes inaccurate due to accumulated size tolerances and deviations
Solution Approach 1:
The support rail is divided into multiple marking levels, where each level contains markings that can be applied without moving the laser head or support rail. This segmentation allows the marking process to be broken down into discrete levels that can be processed efficiently, reducing unnecessary movements and improving both accuracy and time management.
Solution Approach 2:
An image of the support rail and electrical devices is captured beforehand, and based on this image, the positions where markings are to be applied are corrected in advance. This preliminary action compensates for size tolerances and deviations before the actual marking process, ensuring accurate positioning without requiring time-consuming adjustments during marking.
2Adaptability or versatility
If the laser head and support rail are moved frequently to apply markings at different positions, then all marking positions can be reached, but the marking process time increases due to numerous movements and pivoting operations
Solution Approach 1:
Marking instructions are grouped into marking levels based on spatial coordinates and laser head parameters. Each marking level contains all markings that can be applied without moving the laser head or support rail, thereby maximizing marking position coverage while minimizing movements and improving productivity.
Solution Approach 2:
Multiple marking instructions that can be executed without movement are merged into a single marking level. This combining of markings into levels allows the system to apply multiple markings in one position, reducing the total number of movements required and enhancing overall marking efficiency.
3Device complexity
If conventional marking methods are used without position correction, then the marking process is simpler, but incorrect positioning occurs due to accumulated size tolerances and deviations on long support rails
Solution Approach 1:
The system captures an image of the support rail and electrical devices before marking, and corrects the marking positions in advance based on this image. This preliminary position correction compensates for accumulated size tolerances and deviations on long support rails, ensuring accurate marking positions without significantly increasing process complexity.
Solution Approach 2:
The system uses image capture to obtain actual position information of electrical devices on the support rail, and based on this feedback, corrects the planned marking positions. This feedback mechanism ensures that markings are applied at the correct positions despite manufacturing tolerances, maintaining high precision without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and rapid application of markings on electrical devices, reducing unnecessary movements and ensuring accurate positioning, thereby shortening the marking time and improving efficiency.
Implementation Method 1
a laser head which applies the desired markings to marking fields of the devices
Data Source
AI summary
A method and device are provided for marking electrical devices which can be arranged in a row on a support rail, with the aid of a laser head, wherein the support rail is pivotable about its longitudinal axis and the laser head is guided such that it can be moved at least along the longitudinal axis of the support rail. A number of marking instructions, each including a marking content and a position and an orientation of the surface to which the marking content is to be applied are specified. An image of at least a section of the support rail and of at least one electrical device are created from an image capture device and at least one of the positions at which one of the marking contents is to be applied is corrected based on an evaluation of the image. The marking instructions are grouped into marking levels in such a way that all marking instructions of one marking level can be applied by the laser head without a movement of the laser head or the support rail. The marking levels differ in terms of spatial coordinates and/or parameters for the laser head. A first one of the marking levels is selected, and the laser head is positioned and/or the support rail is pivoted according to the spatial coordinates of the selected marking level. Markings are applied according to the marking instructions of the selected marking level with the parameters for the laser head. A next one of the marking levels for marking is selected based on the movements of the laser head and the support rail which would be necessary to enables markings according to the next one of the marking levels to be applied.