Laser Beam Mask Defect Detection for Precise Annealing
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Solution Overview
Problem
In semiconductor processing, precise laser irradiation during the annealing process is challenging due to defects in the mask, which can lead to inefficiencies and reduced yield, as existing methods lack effective defect inspection and reduction techniques.
Innovation Solution
A defect inspection and reduction apparatus and method that uses a chamber with a laser oscillation structure, a mask, a beam profiler, and a damage detector to predict and monitor defects in the laser beam image, performing pre-processing, extraction, and detection of defect areas through image processing and deep learning models to improve laser beam processing and substrate fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is used to process the laser beam into a square shape, then the laser irradiation precision is improved, but defects in the mask can cause harmful effects on the substrate processing
Solution Approach 1:
The patent applies preliminary action by performing defect inspection on the mask before laser processing. The beam profiler captures beam images through the mask, and the damage detector identifies defects in advance, allowing the system to prevent defective masks from causing harmful effects during substrate processing.
Solution Approach 2:
The patent introduces a beam profiler and damage detector as intermediary components between the laser beam and the substrate. These intermediaries capture and analyze the beam characteristics, enabling indirect detection of mask defects without directly interfering with the laser processing function.
2Measurement precision
If deep learning models and image processing are used to detect mask defects, then defect detection precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex mechanical inspection systems with optical-based beam profiling and digital image processing. Instead of using mechanical sensors or complex physical inspection equipment, the system uses a beam profiler to capture optical images and applies deep learning algorithms for automated defect detection, reducing mechanical complexity while maintaining high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise detection and reduction of defects in the mask, enhancing the accuracy of laser irradiation and improving the yield of the annealing process by processing the laser beam into a square shape and upsampling the beam image resolution, thereby improving the quality and reliability of semiconductor substrates.
Implementation Method 1
a laser oscillation structure configured to irradiate a laser beam to a processing area of the substrate
Implementation Method 2
a beam profiler configured to obtain a beam image for the laser beam passing through the mask
Data Source
AI summary
A defect inspection or reduction apparatus includes a chamber moving a substrate and having an inner space therein, a laser oscillation structure irradiating a laser beam to a processing area of the substrate, a mask positioned in the laser oscillation structure and processing the laser beam, a beam profiler obtaining a beam image for the laser beam passing through the mask, and a damage detector detecting a defect area of the mask and the laser beam from the beam image. The damage detector includes an image pre-processing department performing a pre-processing on the beam image that is obtained from the beam profiler, an image extraction department extracting a defect area of the beam image on which the pre-processing is performed, and an image detector detecting a defect of the beam image based on the defect area.