Laser Mass Transfer Stages for Faster Micro LED Panel Repair
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Solution Overview
Problem
The mass transfer technology for micro LED displays faces challenges with increased process time and difficulty in repairing abnormal dies as the size of display panels grows, leading to reduced efficiency and yield.
Innovation Solution
The mass transfer equipment employs a base stage, substrate stages, laser heads, and a servo motor module to facilitate precise movement and alignment of micro device substrates relative to target substrates, utilizing laser lift-off technology for efficient transfer and repair of micro devices, including micro LED dies, by moving the substrates in multiple directions and using a release layer that becomes invalid upon laser irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the size of display panel increases, then the coverage area increases, but the process time increases significantly and repair becomes more difficult
Solution Approach 1:
The system divides the large display panel into multiple micro device substrates, each containing multiple micro LED dies. This segmentation allows the system to process and transfer micro devices in smaller, manageable units across the large panel area, reducing the overall process time while maintaining comprehensive coverage.
Solution Approach 2:
The patent employs multiple movable substrate stages that can independently position and transfer micro device substrates to different locations on the target substrate. This dynamic positioning system enables efficient traversal of large panel areas without increasing process time, as stages can move simultaneously and be precisely controlled to optimal positions.
2Area of stationary object
If the size of display panel increases, then the coverage area increases, but the repair difficulty increases
Solution Approach 1:
By segmenting the display panel into multiple micro device substrates, the system enables localized repair operations. Abnormal dies can be identified and repaired on specific substrate stages without affecting the entire panel, making repair processes more manageable and less difficult as panel size increases.
Solution Approach 2:
The system uses temporary substrate stages as intermediary carriers for micro device substrates. This intermediary approach allows abnormal dies to be isolated, identified, and repaired on the substrate stage before final transfer to the target substrate, simplifying the repair process for large panels.
3Device complexity
If traditional mass transfer technology is used, then the manufacturing process is simple, but the transfer speed and alignment accuracy are insufficient
Solution Approach 1:
The system employs multiple movable substrate stages with precise positioning capabilities, allowing dynamic adjustment of substrate positions during the transfer process. This dynamic positioning system achieves high alignment accuracy by continuously adjusting stage positions based on real-time feedback, surpassing traditional fixed-transfer methods.
Solution Approach 2:
The patent incorporates feedback mechanisms that monitor the positions of substrate stages and micro device substrates during transfer. This feedback system enables real-time correction of alignment deviations, ensuring high manufacturing precision while maintaining a manageable system complexity through automated control.
4Device complexity
If traditional mass transfer technology is used, then the system structure is simple, but the process time increases
Solution Approach 1:
The system segments the transfer process into multiple parallel operations using separate substrate stages. Each stage can independently handle micro device substrates, allowing simultaneous transfer operations that significantly reduce overall process time compared to sequential traditional methods.
Solution Approach 2:
The patent combines multiple substrate stages and transfer mechanisms into a single integrated system. This merging of multiple transfer functions into one coordinated system enables parallel processing of multiple micro device substrates, increasing productivity while maintaining structured system organization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This setup enhances alignment speed and yield by increasing mobility and flexibility in the transfer process, reducing process time, and improving alignment accuracy, thus addressing the inefficiencies in existing mass transfer technologies.
Implementation Method 1
The at least one laser head is adapted to move to a corresponding target position of the second substrate stage and emits a laser beam toward the at least one micro device substrate. The laser beam is used to irradiate the at least one micro device substrate, so that the at least one micro device is separated from the substrate
Data Source
AI summary
Mass transfer equipment including a base stage, a first substrate stage, a second substrate stage, at least one laser head and a servo motor module is provided. The first substrate stage is adapted to drive a target substrate to move along a first direction. The second substrate stage is adapted to drive at least one micro device substrate to move along a second direction. The at least one laser head is adapted to move to a target position of the second substrate stage and emits a laser beam toward the at least one micro device substrate. At least one micro device is separated from a substrate of the at least one micro device substrate and connected with the target substrate after the irradiation of the laser beam. The servo motor module is used for driving the first substrate stage, the second substrate stage and the at least one laser head to move.