Laser Distance Measuring Device Monolithic Optics Carrier
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Solution Overview
Problem
Existing laser distance measuring devices face issues with mechanical fastening reliability due to solder bridges, which lead to poor mechanical and electrical properties, and negatively impact high-frequency performance and electromagnetic compatibility, while also having adjustable limitations and multiple part optics carriers that are not stable under temperature changes.
Innovation Solution
A compact laser distance measuring device design where electro-optical components and beam-shaping optics are adjusted exclusively along their optical axes, using a monolithic optics carrier and a printed circuit board without solder bridges, ensuring high accuracy and stability by avoiding solder bridges and using a metallic optics carrier for electrical shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder bridges are used to connect the printed circuit board to electro-optical components, then mechanical fastening is achieved, but the reliability of the mechanical connection is reduced and cold solder joints can form
Solution Approach 1:
The patent removes the harmful solder bridge connection entirely from the system. Instead of using solder bridges to connect the printed circuit board to electro-optical components, the invention uses a monolithic optics carrier that provides direct mechanical support and positioning, eliminating the source of cold solder joints and their associated reliability problems
Solution Approach 2:
The patent combines the functions of mechanical support, positioning, and electrical connection into a single integrated monolithic optics carrier. This carrier provides both mechanical fastening and electrical connectivity without requiring separate solder bridge connections, thereby improving both mechanical strength and electrical reliability
2Reliability
If solder bridges are used to connect components, then electrical connection is achieved, but high-frequency properties and electromagnetic compatibility are impaired due to inductance
Solution Approach 1:
The patent extracts and removes the solder bridge connection that causes harmful inductance effects. By eliminating the solder bridge entirely and using direct mechanical and electrical connections through the monolithic optics carrier, the source of high-frequency interference and electromagnetic compatibility problems is removed
3Ease of manufacture
If a multi-part optics carrier is used to attach electro-optical components, then component attachment is achieved, but stability under temperature changes is reduced
Solution Approach 1:
The patent merges multiple separate optics carrier parts into a single monolithic structure. This integrated carrier maintains stable dimensional relationships between mounting positions under temperature changes, eliminating the stability problems associated with multi-part assemblies while still providing ease of manufacture through standardized component attachment interfaces
4Manufacturing precision
If electro-optical components are adjusted in multiple directions during assembly, then alignment accuracy is improved, but adjustment complexity and time increase
Solution Approach 1:
The patent segments the adjustment process into two distinct stages: first, rough positioning during assembly using the monolithic optics carrier's built-in positioning features, and second, fine adjustment along the optical axis only. This segmentation reduces the complexity of simultaneous multi-directional adjustment while maintaining high alignment accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of mechanical attachment, improves high-frequency properties, and maintains accuracy and stability under temperature fluctuations, reducing adjustment tolerances and ensuring precise component alignment.
Implementation Method 1
using a monolithic optics carrier and a printed circuit board without solder bridges, ensuring high accuracy and stability by avoiding solder bridges and using a metallic optics carrier for electrical shielding
Data Source
Figure 1
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Figure 3~4
AI summary
Measuring device (20) for measuring a distance between a reference mark and a target object, comprising a beam source (21) designed as an electro-optical component and emitting a laser beam (37) along an optical axis (38), a detector (22) designed as a further electro-optical component and receiving a beam (46) reflected and/or scattered by the target object along an optical axis (47), a beam shaping system comprising at least one beam shaping optic (23) for shaping a laser beam (42) and/or a beam shaping optic (45) along an optical axis (43, 41), an optical carrier (25) comprising a first receptacle (29) for mounting a first of the electro-optical components (21) and a second receptacle (31) for mounting the at least one beam shaping optic (23), and a printed circuit board (26).which has a further receptacle (33) for mounting the second of the electro-optical components (22), and a connecting device (27) which connects a first contact surface (35) of the optical carrier (25) with a second contact surface (36) of the printed circuit board (26), wherein during the adjustment of the measuring device (20) the first of the electro-optical components (21) arranged in the optical carrier (25) and the at least one beam shaping optic (23) are adjustable in the direction of the associated optical axes (38, 43) relative to the optical carrier (25) and the second of the electro-optical components (22) arranged on the printed circuit board (26) is adjustable in a plane substantially perpendicular to the optical axis (47) of the laser or receiving beam (46) associated with the second of the electro-optical components (22) and can be fixed in the adjusted position.