Laser Metallization for Solar Cell Circuit Formation
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Solution Overview
Problem
Current solar cell manufacturing techniques face challenges in increasing efficiency and reducing costs, particularly in the metallization process, which affects the electrical conversion efficiency and manufacturing complexity.
Innovation Solution
The use of a laser beam for metallization of semiconductor substrates, allowing for the direct deposition and patterning of metal foil onto solar cells, creating conductive contact structures that simplify the connection of solar cells into arrays or strings, thereby reducing manufacturing costs and improving efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metallization techniques are used for solar cell manufacturing, then the manufacturing process is simpler and more established, but the electrical conversion efficiency is lower and manufacturing costs are higher
Solution Approach 1:
The patent replaces conventional screen printing and sintering processes with a laser-based direct writing system. The laser beam precisely deposits metal paste to form conductive patterns directly on the solar cell surface, eliminating the need for mechanical screen printing and subsequent high-temperature sintering equipment, thereby improving efficiency while maintaining manufacturing feasibility
Solution Approach 2:
The patent changes the metallization process parameters by using laser energy density, pulse duration, and scanning speed as controllable variables instead of traditional screen mesh size, printing pressure, and sintering temperature. This allows precise control over metal deposition amount and pattern quality, achieving higher conversion efficiency while enabling flexible manufacturing
2Productivity
If conventional screen printing and sintering processes are used, then the manufacturing process is well-established, but the manufacturing costs are higher and production speed is slower
Solution Approach 1:
The patent combines the metal deposition and pattern formation steps into a single laser direct writing operation. The laser beam simultaneously deposits metal paste and creates the desired conductive pattern in one pass, merging what were previously separate screen printing and sintering processes into a unified manufacturing step, thereby increasing production speed
Solution Approach 2:
The patent applies laser pre-heating to the metal paste before final deposition and curing. This preliminary thermal treatment prepares the paste for better adhesion and controlled sintering, reducing the overall process temperature and time requirements, which accelerates production while simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances solar cell conversion efficiency and lowers manufacturing costs by enabling precise and cost-effective metallization, allowing for the formation of efficient solar cell arrays and strings with improved electrical connections.
Implementation Method 1
A laser beam is used to heat and melt a metal foil, and directly depositing the melted metal onto a semiconductor substrate
Implementation Method 2
The laser beam is used to heat and melt the metal foil, and directly depositing the melted metal onto a semiconductor substrate
Data Source
AI summary
A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.