Laser Micro Welding of Insulated Wires in One-Step Attachment
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Solution Overview
Problem
Current micro welding techniques for attaching insulated wires are inefficient, requiring multiple steps and leading to weak and unreliable connections, especially for small gage wires, due to insulation degradation and mechanical handling issues, which increase the complexity and expense of the assembly process.
Innovation Solution
A method and apparatus that uses a laser to simultaneously ablate insulation, weld, and detach insulated wires from a termination point in a single operational step, controlling thermal regions to achieve strong and reliable connections without mechanical forming, suitable for automation and high-volume production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-step processes are used to strip and prepare insulated wires, then the insulation can be removed, but the process complexity increases and the wire becomes more vulnerable to breakage
Solution Approach 1:
The patent combines multiple separate operations (insulation stripping, wire preparation, welding, and trimming) into a single integrated laser processing step. The laser simultaneously removes insulation, heats the wire to welding temperature, forms the weld joint, and trims excess wire, eliminating the need for separate mechanical forming and multiple processing steps while improving connection reliability
Solution Approach 2:
The laser processing system performs multiple functions through a single tool: it acts as both a stripping tool for insulation removal, a heating source for welding, and a cutting tool for trimming. This multi-functional approach replaces multiple specialized tools and processes, reducing overall system complexity while maintaining high connection reliability
2Productivity
If mechanical forming is used to attach stripped wire to termination point, then the wire can be secured, but additional process steps are required which increase complexity and time
Solution Approach 1:
The patent extracts and eliminates the mechanical forming step from the traditional wire attachment process. By using laser heating to directly fuse the wire to the termination point, the process removes the need for winding, wrapping, or clamping operations, thereby reducing process complexity and increasing assembly speed through a single integrated operation
Solution Approach 2:
The patent replaces mechanical forming operations with thermal processing. Instead of using mechanical tools to bend, wind, or clamp the wire into place, the laser heating system softens and fuses the wire directly to the termination point, substituting a thermal field for mechanical action and thereby simplifying the process while improving productivity
3Reliability
If insulation is removed by exposure to molten solder, then the insulation retracts, but the wire remains at risk of damage from solder and chemical reactions degrade joint strength
Solution Approach 1:
The patent converts the potentially harmful effect of thermal exposure into a beneficial process. Instead of using molten solder that causes chemical degradation and mechanical damage, the laser heating system precisely controls thermal exposure to melt and fuse the wire to the termination point without introducing harmful chemicals, thereby eliminating solder-induced joint degradation while maintaining strong connections
Solution Approach 2:
The patent introduces laser heating as an intermediary process between insulation removal and wire attachment. The laser creates a controlled thermal field that simultaneously removes insulation and heats the wire to welding temperature without requiring direct contact with molten solder, thereby preventing chemical reactions between solder and wire while achieving reliable joint formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces handling time, eliminates processing steps, and achieves equivalent or better mechanical and electrical characteristics compared to traditional methods, ensuring robust and reliable attachments for insulated wires, particularly for small gage wires.
Implementation Method 1
heating an area of the wire and termination point via a laser to substantially simultaneously generate a plurality of different heating regions in the area
Implementation Method 2
a first region is heated by the laser to ablate the one or more layers of insulation, a second region is heated by the laser to weld a first portion of the wire to the termination point
Implementation Method 3
a first region is heated by the laser to ablate the one or more layers of insulation
Implementation Method 4
a second region is heated by the laser to weld a first portion of the wire to the termination point
Implementation Method 5
a third region is heated by the laser to melt detach a second portion of the wire proximate to a boundary of the termination point
Data Source
AI summary
An apparatus, system and method for micro welding, wherein insulated object, such as a wire, that includes a metallic conductor that is at least partially covered by one or more layers of insulation, is positioned across a termination point. A laser beam may be applied to an area of the insulated object overlapping the termination point, wherein the applied laser beam is configured to substantially simultaneously (i) ablate the one or more layers of insulation in a first region of the area, (ii) weld the metallic conductor to the termination point in a second region of the area, and (iii) detach a portion of the object from the termination point in a third region of the area.