Laser Microcomponent Transfer for Precise Release and Soldering

The patent replaces conventional mechanical transfer methods with a laser-based system. The laser source emits light that passes through the backplane to selectively decompose the adhesive layer, enabling precise chip release and transfer without mechanical contact. This substitution of mechanical systems with optical/thermal fields resolves the contradiction by achieving both high precision (through localized laser processing) and high yield (through non-contact, contamination-free transfer).

The patent utilizes parameter changes in the adhesive layer's physical and chemical properties. By controlling laser parameters (wavelength, power, pulse duration) to match the adhesive's absorption characteristics, the system selectively modifies the adhesive's bonding strength. This enables precise control over chip release timing and position, simultaneously improving transfer quality and yield through optimized thermal-optical parameter management.

The patent employs periodic pulsed laser action instead of continuous irradiation. By delivering energy in controlled pulses with specific duration and frequency, the system accumulates thermal energy in the adhesive layer selectively, achieving precise decomposition at the chip-substrate interface while allowing heat dissipation from surrounding areas. This periodic action resolves the heat control issue while maintaining high precision chip release.

The laser system achieves local quality control by focusing energy precisely at the adhesive layer beneath each chip. The backplane's optical properties are engineered to guide and concentrate laser energy at specific locations, ensuring that thermal effects are localized only where needed for adhesive decomposition. This localized energy delivery improves chip release precision while minimizing unwanted heat generation in other components.