Laser Microdissection with Real-Time Image-Guided Cutting
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Solution Overview
Problem
Current laser microdissection methods are time-consuming due to the alternating process of defining processing specifications and subsequent processing, with manual and automatic methods requiring significant time for image evaluation and specification definition.
Innovation Solution
A method and system for laser microdissection that detects an object, generates digital object images, and defines processing specifications in real-time, allowing for simultaneous execution of processing steps and specification definition, using a microscope stage or laser scanning device to optimize the cutting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If processing specifications are defined manually or automatically before processing, then processing precision is ensured, but processing time increases significantly
Solution Approach 1:
The patent applies preliminary action by generating a digital object image and defining processing specifications before the actual laser processing begins. This allows the processing plan to be prepared in advance, ensuring precision while enabling parallel execution of image generation and specification definition during processing steps.
Solution Approach 2:
The patent implements continuity of useful action by enabling the system to generate digital object images and define processing specifications continuously during the processing steps. Rather than completing all specification definition before processing, the system maintains continuous productive action by overlapping these operations, thereby reducing total processing time while maintaining precision.
2Measurement precision
If detailed image evaluation is performed to define processing specifications, then processing accuracy is improved, but time consumption increases
Solution Approach 1:
The system performs image evaluation and specification definition continuously during processing steps rather than as separate sequential operations. This allows detailed image evaluation to maintain accuracy while reducing the perceived time consumption by overlapping operations.
Solution Approach 2:
The patent creates a digital copy of the object image that can be evaluated and processed independently from the physical object. This digital replica allows detailed analysis without affecting the physical processing timeline, as evaluations can be performed on the digital copy while the actual processing proceeds.
3Manufacturing precision
If multiple processing steps are executed sequentially, then processing quality is maintained, but overall productivity decreases
Solution Approach 1:
The patent enables multiple processing steps to overlap by continuously generating digital images and defining specifications during processing. This maintains quality through proper sequencing while improving productivity by eliminating idle time between steps.
Solution Approach 2:
By preparing digital object images and processing specifications in advance and during processing steps, the system ensures that subsequent processing steps can proceed without delay, maintaining quality requirements while improving overall throughput through better utilization of processing resources.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly accelerates the processing of objects by parallelizing processing steps and specification definition, reducing overall time and improving efficiency in dissecting multiple samples.
Implementation Method 1
processing the object, in a first processing step in accordance with the first processing specification, using a laser beam of the laser microdissection system
Data Source
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AI summary
A method for laser microdissection includes detecting at least a portion of an object to be dissected in an image-producing manner in a laser microdissection system and generating a first digital object image. A first processing specification is defined based on the first digital object image. In a first processing step, the object is processed using a laser beam of the laser microdissection system in accordance with the first processing specification. At least a portion of the object is detected in an image-producing manner and a second digital object image is generated. A second processing specification is defined during execution of the first processing step based on the second digital object image. In a second processing step, the object is processed using the laser beam of the laser microdissection system in accordance with the second processing specification.