Laser Microdissection System with Long Working Distance Objective

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Solution Overview

Problem

Existing laser microdissection systems cannot effectively observe the bottom of deep wells, such as those in microwell plates, due to the limited working distance of objectives, which causes collisions with the sample and stage, preventing accurate inspection of dissectates captured in these wells.

Innovation Solution

The system incorporates a long working distance objective with an extended parfocal distance, allowing other objectives to pivot without colliding with the sample or stage, and a telescopic spacer ring to adjust the parfocal distance, enabling the inspection of deep wells by positioning the long working distance objective to focus on the well bottom without interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a standard objective is used to observe the sample, then the observation precision is sufficient, but the working distance is too short causing collision with the sample and stage when observing deep wells

Engineering Contradiction:
Improveobservation precisionVSAvoidworking distance
Core Design Contradiction:
Measurement precisionVSLength of moving object

Solution Approach 1:

The patent changes the working distance parameter of the objective by providing a selection between a first objective with a first working distance and a second objective with a second working distance greater than the first working distance. This allows the system to accommodate deep wells by selecting the second objective with extended working distance, preventing collision with the sample and stage while maintaining observation capability.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If the objective is positioned to focus on the bottom of deep wells, then the well inspection capability is improved, but the other objectives collide with the sample and capture unit

Engineering Contradiction:
Improvewell inspection capabilityVSAvoidcollision with sample and stage
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by selecting objectives with different working distances based on the well depth. When inspecting deep wells, the system switches to a second objective with a longer working distance that extends beyond the well depth, ensuring the objective can focus on the well bottom without colliding with the sample or stage.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements dynamics through the objective selection mechanism that allows switching between different objectives with different working distances. The system dynamically adapts the optical configuration based on the specific inspection requirements, selecting the appropriate objective to match the well depth and avoid collisions.

Inventive Principle:
Principle #15Dynamics

3Length of moving object

If a long working distance objective is used, then the working distance is extended, but the parfocal distance may cause collision with sample and stage

Engineering Contradiction:
Improveworking distanceVSAvoidcollision with sample and capture unit
Core Design Contradiction:
Length of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent changes both working distance and parfocal distance parameters by providing a second objective with a second working distance greater than the first working distance and a second parfocal distance greater than the first parfocal distance. This coordinated parameter change ensures that when the second objective is used, its extended parfocal distance prevents collision with the sample and capture unit while maintaining focus on the well bottom.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP4528246A1Laser microdissection system, telescopic spacer ring, and method for laser microdissection
Publication Date: 2025.03.26 LEICA MICROSYSTEMS CMS GMBH
  • EP4528246A1 patent drawingFigure 1
  • EP4528246A1 patent drawingFigure 2
  • EP4528246A1 patent drawingFigure 3A~3B

AI summary

A laser microdissection system (100, 200) comprises a stage (110) configured to receive a sample (104) to be cut and a collection unit (108) comprising at least one well (106) arranged below the sample (104), the well (106) being arranged and configured to capture a dissectate (102) cut from the sample (104). The laser dissection system further comprises an objective nosepiece (112) mounting two or more objectives (114a, 114b, 204) that can be alternately pivoted into the optical axis (O) of the laser microdissection system (100, 200) for at least cutting and/or observing the sample (104). At least one of the objectives (114a, 114b, 204) is configured as a long working distance objective (114a, 204) having a working distance (WD) greater than or equal to the depth of the well (106) with a depth of at least 11.2 mm and at most 42 mm, and is configured such that the other objectives (114b) mounted by the objective nosepiece (112) do not collide with the sample (104), the collection unit (108) and/or the stage (110), when a bottom of the well (106) is in focus of the long working distance objective (114a, 204).