Semiconductor Laser Mirror Layout for Compact Beam-Combining Modules
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Solution Overview
Problem
The miniaturization of light-emitting modules using semiconductor laser packages is limited due to the configuration of each semiconductor laser package, which restricts the compactness and efficiency of the device.
Innovation Solution
A light-emitting device configuration featuring a substrate with a semiconductor laser element, inclined mirror members, and a condensing lens that directs and combines laser beams in a way that allows multiple devices to be arranged closely without interference, reducing the distance between optical axes and enhancing heat dissipation, thereby miniaturizing the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple semiconductor laser packages are arranged to increase laser beam output, then the power output is improved, but the module size increases and miniaturization is limited
Solution Approach 1:
The patent changes the arrangement from a planar configuration to a three-dimensional stacked configuration. Multiple light-emitting devices are arranged vertically along the optical axis direction, with each device positioned at different heights. This vertical stacking enables multiple laser beams to be combined without increasing the horizontal footprint, thereby increasing power output while maintaining compact module size.
Solution Approach 2:
The patent implements a nested structure where multiple light-emitting devices are positioned within a compact vertical space. Each device is nested at a different height level along the optical axis, with mirror members and optical components arranged in a layered fashion. This nesting approach allows multiple functional units to occupy overlapping spatial regions when viewed from the side, effectively increasing power density without proportionally increasing overall module volume.
2Volume of moving object
If the distance between optical axes of multiple light-emitting devices is reduced for miniaturization, then the module size is decreased, but laser beam combination becomes more difficult
Solution Approach 1:
The patent resolves the beam combination difficulty by utilizing the vertical dimension. Instead of attempting to combine beams horizontally where small separations cause overlap and interference, the patent positions devices at different vertical heights along the optical axis. This vertical separation provides sufficient spatial distance for each beam to propagate independently while maintaining a compact horizontal footprint, thus facilitating easier beam combination without increasing module size.
3Volume of moving object
If mirror members are positioned close to the semiconductor laser element for compactness, then the device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent addresses heat dissipation by arranging multiple light-emitting devices vertically along the optical axis at different heights. This vertical distribution creates increased spacing between heat-generating components in the vertical direction, allowing heat to dissipate more effectively without requiring a larger horizontal footprint. The stacked configuration enables thermal management while maintaining compact overall device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of a compact, high-power light-emitting module with improved heat dissipation and efficient laser beam combination, increasing the output while maintaining a small form factor.
Implementation Method 1
the first reflective surface reflects the laser beam to change a traveling direction of the laser beam to a second direction away from the mounting surface of the substrate
Implementation Method 2
the second reflective surface reflects the laser beam reflected by the first reflective surface to change the traveling direction of the laser beam to a third direction that intersects a plane including both a straight line extending in the first direction and a straight line extending in the second direction
Implementation Method 3
a condensing lens configured to combine a plurality of laser beams obtained when the laser beam is emitted from each of the plurality of light-emitting devices in the third direction
Data Source
AI summary
A light-emitting device includes a substrate having a mounting surface, a semiconductor laser element supported by the mounting surface, a first mirror member supported by the mounting surface and having a first reflective surface, and a second mirror member supported by a support member and spaced apart from the first mirror member, and having a second reflective surface at least a part of which is positioned above at least a part of the first reflective surface. The semiconductor laser element is configured to emit a laser beam toward the first reflective surface in a first direction, the first reflective surface reflects the laser beam to change a traveling direction of the laser beam to a second direction, and the second reflective surface reflects the laser beam reflected by the first reflective surface to change the traveling direction of the laser beam to a third direction.