Laser-Modified BaTiO3 Electrode Formation on Ceramic Capacitors

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Solution Overview

Problem

Existing methods for forming electrodes on ceramic electronic components, such as those using electrode paste or electroless plating, face issues of increased component size, complex manufacturing processes, high costs, and limited electrode formation regions, particularly when dealing with titanium-containing metal oxides like BaTiO3 used in multilayer ceramic capacitors.

Innovation Solution

A method involving pulse-laser irradiation of a ceramic base body containing titanium-based metal oxides to create a low-resistance section with specific peak power density and frequency parameters, allowing for electroplating of electrodes on these sections without cracking or abrasion, enabling efficient and cost-effective electrode formation in targeted regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If electrode paste is applied to form outer electrodes, then electrodes can be formed on ceramic base body, but the thickness of the electrode is increased and the external dimensions of the electronic component are increased

Engineering Contradiction:
Improveelectrode thickness controlVSAvoidexternal dimensions
Core Design Contradiction:
Manufacturing precisionVSLength of stationary object

Solution Approach 1:

The patent replaces the mechanical application method (paste coating) with a chemical deposition method (electroless plating). Instead of physically applying paste that adds thickness, the invention uses chemical reactions to deposit metal layers directly on the ceramic surface, eliminating the need for thick paste layers and subsequent firing processes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the fundamental parameters of electrode formation by using electroless plating conditions (chemical bath deposition) instead of paste application parameters (screen printing, thickness control). This allows for precise control of electrode thickness at the micrometer level without adding significant external dimensions.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If electroless plating is used to form outer electrodes by exposing inner electrode end portions and anchor tabs, then plated electrodes can be formed, but the manufacturing process becomes complicated and costs increase

Engineering Contradiction:
Improveelectrode formation precisionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the unnecessary anchor tabs from the manufacturing process. By using inner electrode end portions alone as plating nuclei, the patent removes the complex step of forming and positioning separate anchor tabs, thereby simplifying the overall manufacturing process while maintaining precise electrode formation.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The inner electrode end portions serve multiple functions: they act as both the exposed electrode terminals and the nuclei for electroless plating deposition. This multi-functionality eliminates the need for separate anchor tabs, reducing process complexity while achieving the same plating initiation purpose.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If electroless plating is used with exposed inner electrode end portions, then plated electrodes can be formed, but the regions where the outer electrodes are formed are limited

Engineering Contradiction:
Improveelectrode deposition controlVSAvoidelectrode formation region flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The invention introduces an intermediary substance (sensitivity-enhancing coating or catalytic layer) on the ceramic base body surface that facilitates electroless plating deposition. This intermediary allows plating to occur on regions beyond just the inner electrode end portions, enabling flexible electrode formation on various surface areas of the ceramic component.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies different surface treatments or sensitivity-enhancing coatings to specific regions of the ceramic base body to control where plating occurs. By modifying local surface properties, the invention enables precise control over electrode formation regions while maintaining the ability to form electrodes on diverse areas of the component surface.

Inventive Principle:
Principle #3Local quality

4Manufacturing precision

If laser irradiation is used to form low-resistance sections on ferrite-containing ceramic, then plated electrodes can be formed in given regions, but the method is not suitable for titanium-containing metal oxides like BaTiO3

Engineering Contradiction:
Improvelocalized electrode formationVSAvoidmaterial compatibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The invention changes the material composition parameter of the ceramic base body by incorporating titanium-containing metal oxides (such as BaTiO3) alongside or instead of ferrite. This material substitution enables the ceramic to respond appropriately to laser irradiation for low-resistance section formation, expanding the method's applicability to different ceramic types used in electronic components.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite ceramic material system that combines titanium-containing metal oxides with other ceramic components. This composite approach leverages the favorable properties of titanium-based materials for laser-induced low-resistance formation while maintaining the overall functional requirements of the ceramic electronic component.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the formation of plated electrodes on ceramic electronic components with reduced resistance and improved plating deposition properties, suppressing crack generation and abrasion, thus enabling efficient and cost-effective electrode formation in specific areas, particularly for multilayer ceramic capacitors.

Implementation Method 1

forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser

Methodology Applied
Scientific EffectLaser irradiation: Laser

Implementation Method 2

irradiation with the pulse laser is performed with a peak power density of 1×10^6 W/cm^2 to 1×10^9 W/cm^2

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 3

forming an electrode on the low-resistance section by electroplating

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS10971305B2Method for manufacturing ceramic electronic component and ceramic electronic component
Publication Date: 2021.04.06 MURATA MFG CO LTD
  • US10971305B2 patent drawing
  • US10971305B2 patent drawing

AI summary

A method for manufacturing a ceramic electronic component in which a plated electrode can be formed in a region of the surface of a ceramic base body formed of a titanium-containing metal oxide. The method includes preparing a ceramic base body containing a titanium-containing metal oxide, forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser with a peak power density of 1×106 W/cm2 to 1×109 W/cm2 and a frequency of 500 kHz or less, and forming an electrode on the low-resistance section by electroplating. The laser irradiation generates an O defect in a titanium-containing metal oxide, such as BaTiO3 to form an n-type semiconductor. Since this semiconductor section has a lower resistance value than the metal oxide, plating metal can be selectively deposited by electroplating.