Laser-Modified Region Etching for Reliable Small Chip Cutting
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Solution Overview
Problem
Conventional laser processing methods struggle to reliably cut small chips due to reduced force, while plasma etching methods are time-consuming and may incompletely cut thick objects within limited time constraints.
Innovation Solution
A working method that irradiates a planar object with laser light to form a modified region along a cutting line, followed by an etching process using an etchant with a higher etching rate for the modified region, allowing for selective and rapid cutting, even with small external stress, and ensuring complete cutting of thick objects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external stress is applied to cut small chips, then cutting force is sufficient, but the force acting on each chip becomes smaller as chip size decreases, making reliable cutting difficult
Solution Approach 1:
A modified region is formed in advance along the cutting line using laser irradiation before the actual cutting process. This preliminary modification creates a region with different physical properties that facilitates subsequent cutting, allowing reliable cutting of small chips even when external stress is limited.
Solution Approach 2:
The cutting process creates a localized modified region along the cutting line with distinct properties from the surrounding unmodified material. This local modification enables selective etching and facilitates cutting without requiring high external stress across the entire chip.
2Reliability
If plasma etching method is used to cut thick objects, then complete cutting can be achieved, but it takes a long time and the etching may end incompletely within limited time
Solution Approach 1:
The laser forms a modified region in advance along the cutting line, creating a pathway that is more susceptible to etching. This preliminary preparation allows the etching process to proceed much faster and more completely than conventional plasma etching, enabling complete cutting of thick objects within limited time.
Solution Approach 2:
The laser irradiation changes the physical and chemical parameters of the material along the cutting line, creating a modified region with different etching characteristics. This parameter change enables the etchant to remove material much more rapidly from the modified region compared to unmodified material.
3Speed
If conventional laser processing is used, then cutting speed is fast, but small chips cannot be cut reliably due to reduced force
Solution Approach 1:
The modified region is formed in advance along the cutting line, creating a localized zone that requires minimal force to separate. This allows small chips to be cut reliably even with reduced external stress, while maintaining fast processing speed through the subsequent rapid etching process.
Solution Approach 2:
The invention replaces reliance on mechanical force alone with a combination of laser-induced modification and chemical etching. The etching process does the heavy lifting of material removal, substituting for the mechanical force that would be insufficient for small chips.
4Productivity
If etching process is applied to thick objects within limited time, then productivity is maintained, but the etching may end incompletely without reliably cutting the object
Solution Approach 1:
The laser-formed modified region serves as a pre-prepared pathway that dramatically accelerates the etching process. This preliminary action ensures that even within limited time, the etchant can completely remove the modified region and achieve reliable cutting of thick objects.
Solution Approach 2:
The laser irradiation fundamentally changes the material parameters along the cutting line, creating a modified region with vastly different etching kinetics. This parameter change enables the etching process to proceed at high speed while ensuring complete penetration through thick objects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable cutting of objects along a line with improved precision and speed, reducing the risk of incomplete cuts and chip scattering, and maintaining surface integrity.
Implementation Method 1
irradiating an object to be processed with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut
Implementation Method 2
locating a converging point at the object
Implementation Method 3
etching the modified region formed along the line to cut by an etching process utilizing an etchant exhibiting a higher etching rate for the modified region than for an unmodified region
Data Source
AI summary
An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut. The object formed with the modified region is subjected to an etching process utilizing an etching liquid exhibiting a higher etching rate for the modified region than for an unmodified region, so as to etch the modified region. This can etch the object selectively and rapidly along the line to cut by utilizing a higher etching rate in the modified region.