Semiconductor Laser Module Heat Management via Light-Absorbing Element

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Solution Overview

Problem

Conventional semiconductor laser modules face reliability issues due to heat damage from optical absorption, affecting the adhesive and coated portions, especially when using a glass capillary for optical fiber fixation.

Innovation Solution

A semiconductor laser module design featuring a package with step-like mounting surfaces for semiconductor laser elements, a glass capillary with a light-absorbing element, and an optical filter positioned between condenser lenses to prevent heat-induced damage, utilizing a light-blocking portion and a boot to secure the optical fiber and reduce heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a glass capillary is used to fix the optical fiber, then the optical fiber fixation is improved, but heat damage to the adhesive and coated portions occurs due to optical absorption

Engineering Contradiction:
Improveoptical fiber fixation reliabilityVSAvoidheat damage to adhesive and coated portions
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A light-absorbing element is introduced as an intermediary component between the optical fiber and the package. This element absorbs the harmful light before it can be absorbed by the adhesive and coated portions, thereby preventing heat damage while maintaining secure optical fiber fixation through the glass capillary structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The light-absorbing element converts the harmful optical energy that would otherwise cause heat damage into beneficial heat dissipation. By strategically placing this element, the harmful light absorption is redirected to a controlled location where the heat can be safely managed without damaging critical components

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Power

If the semiconductor laser element output is increased, then the laser power is improved, but heat production increases causing damage to adhesive and coated portions

Engineering Contradiction:
Improvelaser output powerVSAvoidheat damage to adhesive and coated portions
Core Design Contradiction:
PowerVSObject-affected harmful factors

Solution Approach 1:

The light-absorbing element serves as a protective intermediary that intercepts excess optical energy from high-power laser elements. This prevents the energy from reaching and damaging the adhesive and coated portions, enabling the system to operate at higher power levels safely

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The optical path is segmented into distinct zones: the laser element region, the light-absorbing element region, and the optical fiber coupling region. This segmentation allows high-power laser operation in one zone while protecting sensitive components in another zone from heat damage

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances the reliability and safety of the semiconductor laser module by preventing heat damage to the adhesive and coated portions, ensuring high coupling efficiency and prolonged module lifespan.

Implementation Method 1

an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled

Methodology Applied
Scientific EffectCondensation: Condensation

Data Source

PatentUS10061092B2Semiconductor laser module
Publication Date: 2018.08.28 FURUKAWA ELECTRIC CO LTD
  • US10061092B2 patent drawing
  • US10061092B2 patent drawing
  • US10061092B2 patent drawing

AI summary

A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.