Semiconductor Laser Module with Light-Absorbing Region

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Solution Overview

Problem

Conventional semiconductor laser modules face reliability issues due to heat damage from high-power laser absorption, affecting the adhesive and covering portions of optical fibers and glass capillaries, leading to reduced performance and safety concerns.

Innovation Solution

A semiconductor laser module design incorporating an optical fiber with a glass capillary and a fixing member featuring an optical reflection reducing region with a rough surface to absorb laser light, reducing heat absorption and enhancing thermal conductivity, thereby preventing damage to the fixatives and covering portions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the optical fiber and glass capillary are used to guide laser light, then the laser light can be transmitted effectively, but the adhesive and covering portions may be damaged by heat generated from light absorption

Engineering Contradiction:
ImprovereliabilityVSAvoidheat damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A light-absorbing member is introduced as an intermediary component between the optical fiber and the housing. This member absorbs the laser light that leaks from the optical fiber, preventing the light from being reflected by the housing and subsequently absorbed by the adhesive and covering portions. The light-absorbing member acts as a mediator that intercepts and dissipates the harmful light energy before it can reach temperature-sensitive components.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention converts the harmful effect of laser light absorption into a beneficial outcome by strategically placing a light-absorbing member that is designed to withstand and dissipate the thermal energy. The housing and light-absorbing member are configured to absorb and manage the heat generated, preventing it from damaging the adhesive and covering portions. This transforms the potentially harmful thermal energy into controlled heat dissipation that protects critical components.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Device complexity

If conventional fixing methods are used without light-absorbing structures, then the structure is simpler, but reflected light can return to the semiconductor laser device causing instability

Engineering Contradiction:
Improvestructure complexityVSAvoidlaser output stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The light-absorbing member serves as an intermediary that interrupts the reflection path of laser light. By positioning this member between the optical fiber and the housing, it prevents reflected light from returning to the semiconductor laser device, thereby stabilizing the laser output without requiring complex additional control systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The light-absorbing member is strategically positioned only in the specific region where reflected light would return to the laser device. This localized approach addresses the reflection problem only where it occurs, rather than requiring comprehensive light management throughout the entire housing structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly improves the reliability and safety of the semiconductor laser module by efficiently managing heat and reducing the risk of damage to critical components, ensuring high coupling efficiency and prolonged module lifespan.

Implementation Method 1

an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS11031746B2Semiconductor laser module
Publication Date: 2021.06.08 FURUKAWA ELECTRIC CO LTD
  • US11031746B2 patent drawing
  • US11031746B2 patent drawing
  • US11031746B2 patent drawing

AI summary

A semiconductor laser module includes a semiconductor laser device that outputs laser light; an optical fiber that includes a core portion and a cladding portion formed at an outer periphery of the core portion and that receives the laser light from one end and guides the laser light to the outside of the semiconductor laser module; an optical part disposed at an outer periphery of the optical fiber, having optical transmittance at a wavelength of the laser light, and that fixes the optical fiber; a first fixative that fixes the optical part and the optical fiber; and a housing that accommodates the semiconductor laser device and the one end of the optical fiber that receives the laser light, wherein an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part.