Semiconductor Laser Module Base with Junction and Detachment Planes
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Solution Overview
Problem
The base of semiconductor laser modules deforms due to temperature variations, leading to errors in the positional relationship of components and deterioration in optical performance, such as coupling efficiency between the semiconductor laser and optical fiber.
Innovation Solution
A semiconductor laser module design featuring a tabular base with a step difference between a junction plane and a detachment plane, where the semiconductor laser and lens are positioned opposite to these planes, and a Peltier element is used to create a temperature difference between its plates, allowing indirect fixation to the housing, with the junction plane covering 25% to 90% of the base's fixed side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the base is completely fixed to the housing, then the structural stability is improved, but the thermal deformation causes positional errors in components
Solution Approach 1:
The base is divided into a fixed region (junction plane) and a movable region (detachment plane). The fixed region maintains structural stability by being joined to the housing, while the movable region allows thermal deformation without causing positional errors in the components. This segmentation resolves the contradiction by separating the stabilizing function from the precision-maintaining function.
Solution Approach 2:
Different regions of the base are given different properties: the junction plane has high rigidity and is fixed to the housing for stability, while the detachment plane has lower constraint and can move freely to accommodate thermal expansion. This local differentiation allows the base to simultaneously achieve structural stability and maintain component positional precision under temperature variations.
2Stability of the object's composition
If the base is completely detached from the housing, then the thermal deformation is reduced, but the structural support and heat dissipation are insufficient
Solution Approach 1:
The base is segmented into a fixed junction plane that provides structural support and heat dissipation, and a detached detachment plane that minimizes thermal deformation. The junction plane is joined to the housing to ensure structural stability and thermal management, while the detachment plane is left unfixed to reduce the impact of thermal expansion on component positioning.
Solution Approach 2:
The base exhibits local quality differences where the junction plane has high structural coupling for support and heat dissipation, while the detachment plane has low structural coupling to minimize thermal deformation effects. This localized differentiation allows the base to simultaneously achieve structural support and reduce thermal deformation.
3Loss of energy
If the junction plane covers the entire base surface, then the heat dissipation is improved, but the thermal strain causes positional shifts
Solution Approach 1:
The base surface is segmented into a junction plane area for heat dissipation and a detachment plane area for minimizing thermal strain. The junction plane is joined to the housing to provide effective heat dissipation, while the detachment plane is left unfixed to prevent thermal strain from causing positional shifts in the components.
Solution Approach 2:
Different areas of the base are assigned different functions: the junction plane area has high thermal coupling for efficient heat dissipation, while the detachment plane area has low mechanical coupling to prevent thermal strain-induced positional shifts. This local quality differentiation resolves the contradiction between heat dissipation efficiency and positional accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the deterioration in optical performance caused by temperature variations, maintaining efficient coupling and heat management while minimizing positional shifts and thermal strain.
Implementation Method 1
there are times when the temperature is proactively varied using a Peltier element with the aim of controlling the emission wavelength
Data Source
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AI summary
A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.