Laser Encapsulation Module With Brazed Optical Window Sealing
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Solution Overview
Problem
Existing laser chip encapsulating technologies face issues with poor reliability and product quality due to dispensing sealing, limiting further development.
Innovation Solution
A laser encapsulation module with a brazed optical window and base connection, a collimating lens for light shaping, and a double-layer MPCB for electrical connection, enhancing sealing reliability and process yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If dispensing sealing is used for laser chip encapsulation, then the encapsulation process can be simplified, but the sealing reliability and product quality deteriorate
Solution Approach 1:
The patent replaces the mechanical dispensing sealing system with a brazing welding system. The optical window and base are connected through brazing, which provides superior sealing reliability compared to dispensing. This substitution of connection method resolves the contradiction by achieving both reliable sealing and process simplicity through standardized brazing procedures.
Solution Approach 2:
The patent changes the connection parameters from dispensing (adhesive-based) to brazing (metallic bonding). This parameter change in the connection method transforms the sealing mechanism from mechanical/adhesive to metallurgical bonding, thereby improving sealing reliability while maintaining process efficiency through controlled brazing parameters.
2Manufacturing precision
If brazing is used to connect the optical window and base, then the welding quality improves, but the process complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-designing the brazing structure with appropriate joint geometry, material selection, and fixation features. The optical window and base are prepared with specific structural characteristics that facilitate brazing, such as adequate edge thickness and alignment features. This preliminary preparation ensures high welding quality while keeping the actual brazing process simple and controllable.
3Reliability
If the bonding pad is sealed in the accommodating space, then the sealing reliability improves, but the electrical connection difficulty increases
Solution Approach 1:
The patent applies segmentation by dividing the electrical connection path into two parts: the inner pad remains sealed inside the accommodating space with the laser assembly, while the outer pad is exposed outside for electrical connection. The inner circuit layer embedded in the base provides the conductive path between these two pads. This segmentation resolves the contradiction by maintaining sealing integrity for the critical internal components while providing external access for electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The brazed connection and double-layer MPCB design improve the welding quality and process yield, ensuring reliable encapsulation and improved light emission.
Implementation Method 1
the optical window and the base of the laser encapsulation module in the present disclosure are welded through brazing
Implementation Method 2
The collimating lens is configured to shape light emitted from the laser assembly into parallel light
Implementation Method 3
the reflector is arranged in an optical path of light emitted from the laser chip
Data Source
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AI summary
The present disclosure provides a laser encapsulation module, including: a base, wherein the base includes a boss, an optical window pad, an inner pad and an outer pad, and the inner pad and the outer pad are conducted through an inner circuit layer of the base; an optical window, welded on the optical window pad of the base, wherein the optical window and the base form an accommodating space; a laser assembly, wherein the laser assembly is arranged on the boss of the base and accommodated in the accommodating space, and is electrically connected to the inner pad, and wherein laser emitted by the laser assembly exits through the optical window. The optical window and the base of the laser encapsulation module in the present disclosure are welded through brazing, which reduces the process difficulty of the laser encapsulation module on the premise of ensuring the welding quality.