Semiconductor Laser Module Electrode Structure for Stable Heat Dissipation
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Solution Overview
Problem
The existing semiconductor laser module design fails to maintain optimal heat dissipation capability when the thickness of the laser diode element changes, requiring adjustments to the electrically insulating plate and conductive plates, which is time-consuming and inefficient.
Innovation Solution
The semiconductor laser module incorporates a heat sink, anode and cathode electrodes, an electrically insulating layer, a submount, a laser diode element, and an elastic feed structure with a protruding portion, allowing for effective heat dissipation without changing the insulating or conductive plates, even when the laser diode element's thickness changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the thickness of the laser diode element is changed due to design requirements, then the laser device can meet new performance specifications, but the heat dissipation capability deteriorates because the existing electrically insulating plate and conductive plates are optimized for the original thickness
Solution Approach 1:
The electrically conductive plate is designed with a recessed portion that allows it to flexibly adapt to different thicknesses of the laser diode element. The recessed portion enables the conductive plate to maintain optimal contact and heat dissipation performance regardless of whether the laser diode element thickness increases or decreases, thus resolving the contradiction between design adaptability and heat dissipation capability.
Solution Approach 2:
The invention changes the structural parameter of the electrically conductive plate by introducing a recessed portion with specific depth and dimensions. This parameter change allows the conductive plate to accommodate variations in laser diode element thickness while maintaining effective heat dissipation, thus enabling design flexibility without sacrificing thermal performance.
2Adaptability or versatility
If the thickness of the electrically insulating plate or the electrically conductive plates is changed to accommodate a different laser diode element thickness, then the design can be adapted, but the heat dissipation capability is reduced because the original thickness was optimized for the initial design
Solution Approach 1:
The electrically conductive plate with the recessed portion creates a dynamic adaptation mechanism. When the laser diode element thickness changes, the recessed portion allows the conductive plate to adjust its position and maintain optimal thermal contact, thereby adapting to design changes without losing heat dissipation efficiency.
Solution Approach 2:
The electrically conductive plate is segmented into different regions, including the recessed portion and the main body. This segmentation allows the recessed area to accommodate thickness variations while the main body maintains the overall structural integrity and heat dissipation pathway, thus achieving both adaptability and energy efficiency.
3Reliability
If the shape of the electrically conductive plates is changed to optimize heat dissipation for a new laser diode element thickness, then heat dissipation can be maintained, but the device complexity increases and the manufacturing process becomes more time-consuming
Solution Approach 1:
Instead of changing the entire shape of the electrically conductive plate, the invention applies a localized modification by introducing a recessed portion. This local quality change allows the plate to adapt to different laser diode element thicknesses while maintaining the overall simple structure and minimizing manufacturing complexity.
Solution Approach 2:
The invention changes a specific parameter (the depth and dimensions of the recessed portion) rather than the entire plate geometry. This targeted parameter change enables heat dissipation optimization for different laser diode thicknesses while keeping the manufacturing process relatively simple and avoiding excessive device complexity.
4Reliability
If the thickness and shape of the electrically conductive plates are modified to match a changed laser diode element thickness, then optimal heat dissipation can be achieved, but the manufacturing time and design determination process increase significantly
Solution Approach 1:
The recessed portion is pre-designed into the electrically conductive plate at the outset, anticipating future design changes in laser diode element thickness. This preliminary action eliminates the need for time-consuming redesign and reoptimization when thickness changes occur, thus reducing design determination time while maintaining heat dissipation performance.
Solution Approach 2:
The electrically conductive plate with the recessed portion is designed to be universal, accommodating multiple laser diode element thicknesses with a single design. This multi-functionality reduces the need for multiple design iterations and minimizes the time required for design determination across different product variants.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains equivalent heat dissipation performance without altering the insulating or conductive plates, facilitating easy design changes and reducing stress on the laser diode element, thus enhancing operational reliability and efficiency.
Implementation Method 1
a heat sink 11, a first electrode 12 disposed on the heat sink 11
Implementation Method 2
two electrically conductive plates provided respectively in contact with the bottom surface and with the top surface of the laser diode element
Implementation Method 3
The feed structure is electrically conductive, thermally conductive, and elastic, and is disposed on the laser diode element
Data Source
AI summary
A semiconductor laser module includes a heat sink, a first electrode disposed in a first region of the heat sink, an electrically insulating layer disposed on the first electrode, a submount that is disposed in a second region of the heat sink and is electrically conductive and thermally conductive, a laser diode element that is disposed on the submount and emits a laser beam, a feed structure that is disposed on the laser diode element and is electrically conductive, thermally conductive, and elastic, and a second electrode disposed on and in contact with the electrically insulating layer and the feed structure. The second electrode includes an electrode-facing portion having a flat surface in contact with the electrically insulating layer, and a protruding portion having a flat surface in contact with the feed structure, and protruding toward the heat sink with respect to the electrode-facing portion.