Semiconductor Laser Module With Separate Mirror Collimator
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Solution Overview
Problem
Forming a parabolic reflecting surface on a metal stem for a semiconductor laser module is difficult, making it challenging to create a semiconductor laser module with a semiconductor laser chip and a collimator element that effectively collimates laser light.
Innovation Solution
A semiconductor laser module design that includes a semiconductor laser chip, a first collimator element with a concave mirror surface, and a package with a body, cap member, and window member, where the collimator element is separate from the submount, allowing for easier formation of the mirror surface and collimation of laser light closer to the light-emitting point, reducing divergence angles, and incorporating a second collimator element to further reduce divergence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a parabolic reflecting surface is formed on a metal stem, then the laser light can be collimated, but it becomes difficult to form the reflecting surface
Solution Approach 1:
The collimator element is separated from the submount structure, allowing the mirror surface to be formed on a dedicated optical component rather than integrating it into the metal stem. This segmentation enables specialized manufacturing processes for the mirror surface while keeping the submount structure simple.
Solution Approach 2:
A separate collimator element with a mirror surface acts as an intermediary component between the semiconductor laser chip and the external environment. This mediator performs the collimation function without requiring complex formation processes on the submount itself.
2Volume of moving object
If the collimator element is integrated with the submount, then the structure is compact, but the mirror surface formation becomes more difficult
Solution Approach 1:
The collimator element is designed as a separate component from the submount, enabling independent optimization of each part. The submount focuses on mechanical support and electrical connection, while the collimator element specializes in optical function with an easily formable mirror surface.
Solution Approach 2:
The patent changes the material or structural parameters of the collimator element to facilitate mirror surface formation. By using a suitable material for the collimator element, the mirror surface can be formed more easily compared to forming it directly on the metal submount.
3Quantity of substance
If the collimator element is placed closer to the light-emitting point, then the spot diameter is reduced and laser light density increases, but the divergence angle reduction becomes more challenging
Solution Approach 1:
The collimator element employs a curved mirror surface (parabolic or spherical) to effectively collimate laser light at short distances. The curvature of the mirror surface is specifically designed to compensate for the divergent nature of laser light from the chip, enabling effective collimation even when placed close to the light-emitting point.
Solution Approach 2:
The patent optimizes the focal length and curvature radius of the mirror surface based on the specific requirements of laser light collimation. By carefully selecting these optical parameters, the system achieves both reduced spot diameter and effective divergence angle reduction despite the short distance between the light-emitting point and the collimator element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables miniaturization, improved beam quality, reduced contamination, and increased laser light density by collimating laser light with smaller spot diameters, while maintaining a compact size and reducing assembly complexity and optical element degradation.
Implementation Method 1
Each of the at least one first collimator element includes a mirror surface in a concave shape and opposed to the light-emitting point. The mirror surface reflects the laser light toward the opening and reduces the divergence angle of the laser light along the first axis.
Data Source
AI summary
A semiconductor laser module includes a semiconductor laser chip, a first collimator element, and a package. The package includes: a body having a bottom and a top with an opening; a cap member; and a window member. The semiconductor laser chip has a light-emitting point for emitting laser light. The semiconductor laser chip is located on the bottom so as to emit the laser light in a direction parallel to the principal surface of the bottom. The laser light has a greater divergence angle along the first axis than a divergence angle along a second axis perpendicular to the first axis. The first collimator element includes a concave mirror surface. The mirror surface reflects the laser light toward the opening, and reduces the divergence angle of the laser light along the first axis.